COPPER ALLOY FOIL, FLEXIBLE PRINTED WIRING BOARD OBTAINED USING SAME, AND PROCESS FOR PRODUCING COPPER ALLOY FOIL
    2.
    发明公开
    COPPER ALLOY FOIL, FLEXIBLE PRINTED WIRING BOARD OBTAINED USING SAME, AND PROCESS FOR PRODUCING COPPER ALLOY FOIL 有权
    合金铜箔,柔性印刷电路板组装体和方法生产铜合金箔

    公开(公告)号:EP2479298A1

    公开(公告)日:2012-07-25

    申请号:EP10815489.9

    申请日:2010-09-13

    摘要: The zirconium content of the alloy composition of a copper alloy foil 10 of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil 10 includes copper matrix phases 30 and composite phases 20 composed of copper-zirconium compound phases 22 and copper phases 21. As shown in Fig. 1 , the copper matrix phases 30 and the composite phases 20 form a matrix phase-composite phase layered structure and are arranged alternately parallel to a rolling direction as viewed in a cross-section perpendicular to the width direction. In addition, the copper-zirconium compound phases 22 and the copper phases 21 in the composite phases 20 form a composite phase inner layered structure and are arranged alternately parallel to the rolling direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double layered structure presumably makes the copper alloy foil 10 densely layered to provide a strengthening mechanism similar to multilayer reinforced composite materials.

    摘要翻译: 的铜合金的合金组合物的锆含量贴膜本发明的图10是3.0〜7.0原子%,且该铜合金箔10包括铜母相30和铜 - 锆化合物相22和铜相的复合体相20 21.如在图1中,铜母相30和复合相20形成基体相复合相层状结构和交替排列平行于当在横截面垂直于该宽度方向观察的轧制方向。 此外,铜 - 锆化合物相22和铜相21的复合相20形成复合相内层状结构,交替排列平行于轧制方向上为50nm或更小的相沥青作为上方观察 横截面。 这种双层结构想必使铜合金箔10密集地层叠以提供类似于多层强化复合材料的加固机制。

    COPPER ALLOY AND PROCESS FOR MANUFACTURING SAME
    8.
    发明公开
    COPPER ALLOY AND PROCESS FOR MANUFACTURING SAME 有权
    KUPFERLEGIERUNG UND VERFAHREN ZU SEINER HERSTELLUNG

    公开(公告)号:EP2915890A1

    公开(公告)日:2015-09-09

    申请号:EP13850956.7

    申请日:2013-10-24

    摘要: A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu-Zr compound, and two phases of the Cu and the Cu-Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 µm or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu-Zr binary system alloy powder at a temperature of 0.9Tm°C or less (Tm(°C): melting point of the alloy powder) by supply of direct-current pulse electricity, the Cu-Zr binary system alloy powder having an average grain diameter of 30 µm or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu-Zr compound may include at least one of Cu 5 Zr, Cu 9 Zr 2 , and Cu 8 Zr 3 .

    摘要翻译: 本发明的铜合金含有5.00〜8.00原子%的Zr,并且包括Cu和Cu-Zr化合物,并且Cu和Cu-Zr化合物的两相形成不包含共晶相的马赛克状结构, 当从横截面观察时,分散尺寸为10μm或更小的晶体。 该铜合金通过包括在0.9Tm℃以下的温度下在Cu-Zr二元系合金粉末上进行放电等离子体烧结的烧结工序(Tm(℃):合金粉末的熔点) ),通过供给直流脉冲电,平均粒径为30μm以下的Cu-Zr二元系合金粉末和含有5.00〜8.00原子%的Zr的亚共晶组成。 Cu-Zr化合物可以包括Cu 5 Zr,Cu 9 Zr 2和Cu 8 Zr 3中的至少一种。