发明公开
EP2916335A1 COIL ELEMENT PRODUCTION METHOD 审中-公开
VERFAHREN ZUR HERSTELLUNG EINES SPULENELEMENTS

  • 专利标题: COIL ELEMENT PRODUCTION METHOD
  • 专利标题(中): VERFAHREN ZUR HERSTELLUNG EINES SPULENELEMENTS
  • 申请号: EP12887637.2
    申请日: 2012-10-30
  • 公开(公告)号: EP2916335A1
    公开(公告)日: 2015-09-09
  • 发明人: SANO, TakashiTERADA, Tokinori
  • 申请人: Leap Co. Ltd.
  • 申请人地址: 13-12 Chigasakichuo Tsuzuki-ku Yokohama-shi Kanagawa 224-0032 JP
  • 专利权人: Leap Co. Ltd.
  • 当前专利权人: Leap Co. Ltd.
  • 当前专利权人地址: 13-12 Chigasakichuo Tsuzuki-ku Yokohama-shi Kanagawa 224-0032 JP
  • 代理机构: Becker Kurig Straus
  • 国际公布: WO2014068613 20140508
  • 主分类号: H01F41/04
  • IPC分类号: H01F41/04 H01F17/00
COIL ELEMENT PRODUCTION METHOD
摘要:
Provided is a method for manufacturing a coil element, which does not adversely affect the coil element pattern after taking out for use. A method for manufacturing a coil element using a transferring mold, includes: preparing a transferring mold, on a surface of which an inverted coil element pattern is engraved, the transferring mold having at least a surface part made of metal; forming a center conductive film by first electroplating at the transferring mold as a whole so as to have a thickness exceeding a thickness of an area where the inverted coil element pattern is engraved; removing the center conductive film from a surface by a predetermined thickness by polishing or grinding so as to flatten the surface of the center conductive film; releasing the flattened center conductive film from the transferring mold; coating a protective film at a surface as a whole of the released center conductive film on a side where the coil element pattern is formed; etching the center conductive film for removal from the side subjected to the flattening so that the side reaches the protective film; and removing the protective film and taking out the center conductive film.
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