公开(公告)号：EP2916336A1

公开(公告)日：2015-09-09

申请号：EP12887740.4

申请日：2012-10-30

申请人： Leap Co. Ltd.

发明人： SANO, Takashi ,  TERADA, Tokinori

IPC分类号： H01F41/04 ,  H01F17/00

CPC分类号： H01F41/04 ,  C25D1/00 ,  H01F17/0013 ,  H01F41/041

摘要： To manufacture a coil component having a high-aspect conductive pattern. A method for manufacturing a coil element being characterized by comprising: forming a groove in a substrate surface of a resin substrate; forming a metallic coating; forming a resist pattern being a reverse pattern of a coil element pattern on the substrate surface to sandwich the groove, so as to have a desired thickness T; forming a central conductive film of the coil element on the substrate surface including the groove, by a first electroforming with the resist pattern as a mask, so as to have a height t equal to or less than the desired thickness T; removing the resist pattern and the exposed metallic coating; forming a surface conductive film by a second electroforming with the central conductive film as a foundation, to form a coil element made of the central conductive film and surface conductive film; peeling away the coil element from the resin substrate; and removing a portion formed in the groove, of the central conductive film of the peeled coil element by reverse electrolytic etching.

摘要翻译： 制造具有高方位导电图案的线圈部件。 一种线圈元件的制造方法，其特征在于包括：在树脂基板的基板表面形成槽; 形成金属涂层; 在所述基板表面上形成作为线圈元件图案的反向图案的抗蚀剂图案以夹持所述凹槽，以具有期望的厚度T; 通过以抗蚀剂图案作为掩模的第一次电铸形成包含凹槽的衬底表面上的线圈元件的中心导电膜，使其具有等于或小于所需厚度T的高度t; 去除抗蚀剂图案和暴露的金属涂层; 通过以中心导电膜为基础的第二次电铸形成表面导电膜，形成由中心导电膜和表面导电膜制成的线圈元件; 从树脂基板剥离线圈元件; 并且通过反向电解蚀刻去除剥离的线圈元件的中心导电膜的凹槽中形成的部分。

公开(公告)号：EP2781628A1

公开(公告)日：2014-09-24

申请号：EP11875931.5

申请日：2011-11-15

申请人： Leap Co. Ltd.

发明人： SANO, Takashi ,  TERADA, Tokinori

IPC分类号： C25D1/10 ,  B29C33/38

CPC分类号： C25D1/003 ,  C25D1/00 ,  C25D1/10 ,  C25D1/20 ,  C25D1/22

摘要： A transfer mold, which has superior durability and high aspect ratio, for production of a component by electroplating and a component produced thereby are provided. A method therefor includes the steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate 10, a sidewall of the resist pattern forming a desired angle α; creating a transfer mold by filing up the resist pattern having the shape of the component by electroplating to a predetermined thickness; and providing a master mold 20 by separating the transfer mold from the metal substrate.

摘要翻译： 本发明提供一种转印模具，其具有优异的耐久性和高的纵横比，对于生产通过电镀和由此产生的成分的组分。 其方法包括以下步骤：形成具有部件的形状与在金属基材10中的希望的纵横比的抗蚀剂图案，的侧壁的抗蚀剂图案形成所需角度±; 通过提出了创建转印模通过电镀到预定的厚度具有部件的形状的抗蚀剂图案; 并且通过从金属基材分离转印模具中提供一个母模20。

公开(公告)号：EP2781627A1

公开(公告)日：2014-09-24

申请号：EP11875832.5

申请日：2011-11-15

申请人： Leap Co. Ltd.

发明人： SANO, Takashi ,  TERADA, Tokinori

IPC分类号： C25D1/10 ,  B29C33/38

CPC分类号： C25D1/10 ,  B29C33/424

摘要： A multi-stage transfer mold manufacturing method that can save labor in a step of connecting by a multi-stage connection, a multi-stage transfer mold manufactured thereby, and a component produced thereby are provided for production of a multi-stage component by electroplating. A method therefor includes the steps of: forming a resist pattern having a shape of a component with a desired aspect ratio on a metal substrate, a sidewall of the resist pattern forming a desired angle α; forming, on the resist pattern, a resist pattern having a shape and a thickness of a connection pillar for connecting with an upper layer; creating a transfer mold by filling up the resist pattern on which the resist pattern having the shape of the connection pillar by electroplating to a predetermined thickness; and providing a master mold by separating the transfer mold from the metal substrate.

摘要翻译： 一种多级转印模具的制造方法做可以节省劳动在由多级连接，由此制造的多级转印模，从而产生了部件连接的步骤中，提供了一种用于生产通过电镀的多级组件的 ， 其方法包括以下步骤：形成具有部件的形状与在金属基材一个希望的高宽比，形成所需角度±抗蚀剂图案的侧壁的抗蚀剂图案; 形成，在抗蚀剂图案，抗蚀剂具有形状和用于与在上层连接的厚度的连接支柱的图形; 通过填充该抗蚀剂图案创建转印模在其上通过电镀成预定的厚度具有连接柱的形状的抗蚀剂图案; 并且通过从金属基材分离转印模具中提供一个母模。

公开(公告)号：EP2927919A1

公开(公告)日：2015-10-07

申请号：EP12887584.6

申请日：2012-10-30

申请人： Leap Co. Ltd.

发明人： SANO, Takashi ,  TERADA, Tokinori

IPC分类号： H01F41/04 ,  H01F17/00

CPC分类号： H01F41/04 ,  H01F41/041 ,  H01F41/046

摘要： A coil component is produced without using an insulating substrate. A method for producing a coil element by using a transfer mold is provided which includes a step of preparing a transfer mold having an inverse coil element pattern etched thereon, a step of forming a peel-away film and an insulating film on the surface of the transfer mold in a superimposed manner, a step of forming a resist film in an area having no inverse coil element pattern formed therein on the insulating film, a step of removing by etching the insulating film with the resist film as a mask, a step of after removing the resist film, filling up an area having the inverse coil element pattern formed therein and forming a central conductive film by first electroplating so as to slightly protrude above the insulating film, a step of peeling the central conductive film from the transfer mold, and a step of forming a surface conductive film by second electroplating with the central conductive film as a foundation and forming a coil element comprised of the central conductive film and the surface conductive film.

摘要翻译： 在不使用绝缘基板的情况下制造线圈部件。 提供了一种通过使用转印模制造线圈元件的方法，该方法包括制备其上蚀刻有反向线圈元件图案的转印模具的步骤，在该表面上形成剥离膜和绝缘膜的步骤 在绝缘膜上形成没有反向线圈元件图案的区域中形成抗蚀剂膜的步骤，通过用抗蚀剂膜作为掩模蚀刻绝缘膜的步骤，将步骤 在除去抗蚀剂膜之后，填充其中形成有反向线圈元件图案的区域，并通过第一次电镀形成中心导电膜，从而稍微突出在绝缘膜上方，从转印模上剥离中心导电膜， 以及通过以中心导电膜为基础的第二次电镀形成表面导电膜的步骤，并形成由中心导电膜构成的线圈元件和 表面导电膜。

公开(公告)号：EP2916335A1

公开(公告)日：2015-09-09

申请号：EP12887637.2

申请日：2012-10-30

申请人： Leap Co. Ltd.

发明人： SANO, Takashi ,  TERADA, Tokinori

IPC分类号： H01F41/04 ,  H01F17/00

CPC分类号： H01F41/041 ,  C23C14/34 ,  C23C16/44 ,  C25D1/00 ,  H01F17/0013

摘要： Provided is a method for manufacturing a coil element, which does not adversely affect the coil element pattern after taking out for use. A method for manufacturing a coil element using a transferring mold, includes: preparing a transferring mold, on a surface of which an inverted coil element pattern is engraved, the transferring mold having at least a surface part made of metal; forming a center conductive film by first electroplating at the transferring mold as a whole so as to have a thickness exceeding a thickness of an area where the inverted coil element pattern is engraved; removing the center conductive film from a surface by a predetermined thickness by polishing or grinding so as to flatten the surface of the center conductive film; releasing the flattened center conductive film from the transferring mold; coating a protective film at a surface as a whole of the released center conductive film on a side where the coil element pattern is formed; etching the center conductive film for removal from the side subjected to the flattening so that the side reaches the protective film; and removing the protective film and taking out the center conductive film.

摘要翻译： 提供一种用于制造线圈元件的方法，其在取出使用后不会对线圈元件图案产生不利影响。 一种使用转印模具制造线圈元件的方法，包括：制备转印模具，其表面上刻有倒置的线圈元件图案，所述转印模具至少具有由金属制成的表面部分; 通过在转印模具整体上首先电镀形成中心导电膜，使得其厚度超过倒置的线圈元件图案被雕刻的区域的厚度; 通过抛光或研磨从表面去除预定厚度的中心导电膜，以使中心导电膜的表面变平; 从转移模具释放扁平的中心导电膜; 在形成线圈元件图案的一侧的释放的中心导电膜的整个表面上涂覆保护膜; 蚀刻中心导电膜以便从经过平坦化的一侧去除，使得侧面到达保护膜; 并取出保护膜并取出中心导电膜。

公开(公告)号：EP2916334A1

公开(公告)日：2015-09-09

申请号：EP12887605.9

申请日：2012-10-30

申请人： Leap Co. Ltd.

发明人： SANO, Takashi ,  TERADA, Tokinori

IPC分类号： H01F41/04 ,  H01F17/00

CPC分类号： H01F41/041 ,  H01F17/0013 ,  Y10T29/49021

摘要： Provided is a method for manufacturing a coil element, capable of manufacturing a coil element using a resin mold and without performing releasing and transferring, and capable of thinning the coil element. A method for manufacturing a coil element using a resin mold that is soluble in organic solvent, includes: preparing a resin mold, on a surface of which an inverted coil element pattern is engraved; forming a metal seed film on the surface of the resin mold; removing the metal seed film in an area where the inverted coil element pattern is not formed; forming a center conductive film so as to fill an area where the inverted coil element pattern is engraved by first electroplating while using the metal seed film as a base; and dissolving the resin mold to take out the center conductive film.

摘要翻译： 本发明提供一种线圈元件的制造方法，其能够使用树脂模制造线圈元件而不进行释放和转移，并且能够使线圈元件变薄。 一种使用可溶于有机溶剂的树脂模具制造线圈元件的方法，包括：制备树脂模具，在树脂模具的表面上刻有倒置的线圈元件图案; 在树脂模具的表面上形成金属种膜; 去除未形成倒置线圈元件图案的区域中的金属籽晶膜; 以所述金属晶种膜为基底，通过第一次电镀形成中央导电膜以填充所述倒置线圈元件图案被刻印的区域; 并溶解树脂模具以取出中心导电膜。

公开(公告)号：EP2781626A1

公开(公告)日：2014-09-24

申请号：EP11875786.3

申请日：2011-11-15

申请人： Leap Co. Ltd.

发明人： SANO, Takashi ,  TERADA, Tokinori

IPC分类号： C25D1/10 ,  B29C33/38

CPC分类号： B29C59/02 ,  B29C33/3842 ,  B29C33/58 ,  C25D1/00 ,  C25D1/003 ,  C25D1/22 ,  Y10T428/24802

摘要： A transfer mold that is used in production of a component by electroplating and has high workability and superior durability as well as a component produced thereby are provided. A method therefor includes the steps of: forming a pattern of a desired component by providing a reverse pattern of the pattern of the desired component on a metal substrate 10 and etching the metal substrate 10 using the reverse pattern as a mask; and treating the reverse pattern with heat or removing the reverse pattern and forming an insulation layer 30, 50 in a portion where the reverse pattern has been removed.

摘要翻译： 转印模具并通过电镀在生产的组件的使用，并且具有高的加工性和优异的耐久性，以及由此产生被提供的组件。 其方法包括以下步骤：通过在金属基片10提供期望的成分的图案的反转图案和使用反向图案作为掩模蚀刻该金属基板10形成所需部件的图案; 和治疗与热反转图案或除去相反图案和反转图案已经被移除的部分绝缘层30，50的成形。