There is provided a pellicle having a frame 12, a film 11 and an adhesive 13 for bonding the film 11 to the frame 12, and this adhesive 13 is a silicone compound having a low outgassing tendency and high heat resistance; in a better mode case, it can maintain its adhesive strength at temperatures 100 - 200 degrees C and it exhibits results of TML being 1.0 % or lower and CVCM being 0.1 % or lower when tested in accordance with ASTM E595-93; thus this pellicle is useful for EUV light exposure lithography.