REFLECTIVE MASK BLANK, AND MANUFACTURING METHOD OF REFLECTIVE MASK

    公开(公告)号:EP4443235A2

    公开(公告)日:2024-10-09

    申请号:EP24164620.7

    申请日:2024-03-19

    IPC分类号: G03F1/24 G03F1/48 G03F1/58

    CPC分类号: G03F1/24 G03F1/58 G03F1/48

    摘要: In a reflective mask blank including a substrate, a multilayer reflection film, a protection film, an absorber film and a hard mask film, the protection film is composed of a material containing ruthenium (Ru), the absorber film consists of a first layer and a second layer, or a first layer, a second layer and a third layer, the first layer has a composition containing tantalum (Ta) and being free of nitrogen (N), the second layer has a composition containing tantalum (Ta) and nitrogen (N), the third layer has a composition containing tantalum (Ta), nitrogen (N) and oxygen (O), and the hard mask film is composed of a material containing chromium (Cr).

    COMPOSITION CONTAINING ORGANOSILICON COMPOUND

    公开(公告)号:EP4442693A1

    公开(公告)日:2024-10-09

    申请号:EP22898316.9

    申请日:2022-10-27

    发明人: HIROKAMI, Munenao

    摘要: This composition containing an organosilicon compound represented by formula (1) and an amino group-containing organosilicon compound can impart excellent washing durability and sustained antibacterial and antiviral performance to a synthetic fiber such as a polyester fiber.

    (In the formula, R1 each independently represent a C1-C10 alkyl group or a C6-C10 aryl group, R2 each independently represent a C1-C10 alkyl group or a C6-C10 aryl group, R3 represents a C12-C24 alkyl group, R4 and R5 each independently represent a C1-C10 alkyl group, X represents a halogen atom, m represents an integer of 1-20, and n represents an integer of 1-3.)

    METHOD OF CONTINUOUSLY PRODUCING DEPOLYMERIZED CELLULOSE ETHER

    公开(公告)号:EP4438630A1

    公开(公告)日:2024-10-02

    申请号:EP24167683.2

    申请日:2024-03-28

    IPC分类号: C08B11/02 C08B11/08 C08L1/28

    摘要: Provided is a method of continuously producing a depolymerized cellulose ether that is space-saving and highly productive, and is capable of reducing adhesion of a cellulose ether powder body to reactors and producing a depolymerized cellulose ether with a suppressed degree of yellowness and contaminants. The method includes: bringing a raw material cellulose ether that is of a temperature of 3°C to less than 40°C and is continuously supplied from a raw material tank 1 to a moisture conditioning tank 2 into contact with a water vapor B to obtain a moisture-conditioned cellulose ether; heating the moisture-conditioned cellulose ether to obtain a heated cellulose ether; continuously bringing a gaseous hydrogen chloride into contact with the heated cellulose ether to obtain a depolymerized cellulose ether product; and mixing the depolymerized cellulose ether product with a basic compound to obtain a depolymerized cellulose ether.

    COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS

    公开(公告)号:EP4435515A1

    公开(公告)日:2024-09-25

    申请号:EP24160203.6

    申请日:2024-02-28

    IPC分类号: G03F7/075

    CPC分类号: G03F7/0752

    摘要: The present invention is a composition for forming a silicon-containing resist underlayer film, containing a condensation reaction-type thermosetting silicon-containing material (Sx), being a polysiloxane resin, where the material has a non-condensation reactive organic group that reacts with a radical chemical species, the resin includes more than 0 and 70 mol% or less of one or more of a repeating unit represented by the following general formula (Sx-4) and a repeating unit represented by the general formula (Sx-5), and the organic group remains unreacted after a heat-curing reaction of the polysiloxane resin. This provides: a composition for forming a resist underlayer film containing a thermosetting silicon-containing material in photolithography using a high-energy beam, the material improving sensitivity, LWR, and resolution of an upper layer resist and further contributing to the prevention of pattern collapse; and a patterning process using the composition for forming a resist underlayer film.