发明公开
- 专利标题: GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE
- 专利标题(中): 气体入口孔阵列结构和焊接设备
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申请号: EP13868049申请日: 2013-12-20
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公开(公告)号: EP2941104A4公开(公告)日: 2016-09-14
- 发明人: HIYAMA TSUTOMU
- 申请人: SENJU METAL INDUSTRY CO
- 专利权人: SENJU METAL INDUSTRY CO
- 当前专利权人: SENJU METAL INDUSTRY CO
- 优先权: JP2012288292 2012-12-28
- 主分类号: H05K3/34
- IPC分类号: H05K3/34 ; B05B1/00 ; B23K1/00 ; B23K1/008 ; B23K1/012 ; B23K3/04 ; B23K101/40 ; B23K101/42 ; F27B9/02 ; F27B9/06 ; F27B9/10
摘要:
In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P2 is arranged to be line symmetry with a nozzle pattern P1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 in the other upper or lower divided section. Intake ports 3b, 3c and 3d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2. Widths of the intake ports 3b, 3c and 3d are set so that they are gradually become narrower with increasing distance from the center portion.
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