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8 条记录 (耗时 0.017 秒)

    FLUX RECOVERY DEVICE AND SOLDERING DEVICE
    1.
    发明公开
    FLUX RECOVERY DEVICE AND SOLDERING DEVICE 审中-公开
    FLUSSMITTELRÜCKGEWINNUNGSVORRICHTUNGUNDLÖTVORRICHTUNG

    公开(公告)号：EP3064304A4

    公开(公告)日：2017-07-05

    申请号：EP14858673

    申请日：2014-06-13

    申请人： SENJU METAL INDUSTRY CO

    发明人： HIYAMA TSUTOMU ,  SAITO YUTA

    IPC分类号： B23K3/08 ,  B23K1/008 ,  B23K101/42 ,  H05K3/34

    CPC分类号： B23K3/08 ,  B01D47/06 ,  B01D47/16 ,  B01D53/265 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0638 ,  B23K3/0653 ,  B23K35/362 ,  B23K2201/42

    摘要： To separate gas containing no flux component from a gaseous mixture containing the flux component and recover the flux component. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused. Provided are a first water spray unit (20A) that sprays water into a gaseous mixture containing the flux component; a separation unit (10) that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit (20A), the separation unit using a swirling flow to separate the flux component from the gaseous mixture; a second water spray unit (20B) that forms a precipitation flow inside of the separation unit; and a condensation unit (17) that cools water vapor generated in the separation unit (10) to change the water vapor to water droplets, thereby removing the water vapor.

    摘要翻译： 从含有助熔剂组分的气体混合物中分离不含助熔剂组分的气体并回收助熔剂组分。 在分离单元中产生的水蒸气被冷凝单元冷却，以水滴的形式回收并重新使用。 提供了第一喷水单元（20A），所述第一喷水单元（20A）将水喷射到含有所述焊剂成分的气体混合物中; 分离单元（10），该分离单元（10）包括用于引入从第一喷水单元（20A）喷射水的气体混合物的引入口，分离单元使用旋流分离助熔剂组分和气体混合物; 第二喷水单元（20B），其在分离单元内部形成沉淀物流; 以及冷凝单元（17），其冷却在分离单元（10）中产生的水蒸气，以将水蒸气变成水滴，从而去除水蒸气。

    GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE
    3.
    发明公开
    GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE 有权
    气体入口孔阵列结构和焊接设备

    公开(公告)号：EP2941104A4

    公开(公告)日：2016-09-14

    申请号：EP13868049

    申请日：2013-12-20

    申请人： SENJU METAL INDUSTRY CO

    发明人： HIYAMA TSUTOMU

    IPC分类号： H05K3/34 ,  B05B1/00 ,  B23K1/00 ,  B23K1/008 ,  B23K1/012 ,  B23K3/04 ,  B23K101/40 ,  B23K101/42 ,  F27B9/02 ,  F27B9/06 ,  F27B9/10

    CPC分类号： B05B1/005 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K3/04 ,  F27B9/02 ,  F27B9/06 ,  F27B9/10 ,  F27D5/0037 ,  H05K3/3494 ,  H05K2203/081

    摘要： In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P2 is arranged to be line symmetry with a nozzle pattern P1 in one upper or lower divided section of a nozzle layout region of the nozzle cover 3 relative to a center portion that is orthogonal to a conveying direction, as shown in FIG. 1 . In order for the arrangement patterns diagonally arranged in the nozzle layout region to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 in the other upper or lower divided section. Intake ports 3b, 3c and 3d each having a predetermined opening width are arranged between two blowing nozzles 2 or more and across a first row thereof and plural other rows having different phases, in order to circulate the gas blown from the blowing nozzles 2. Widths of the intake ports 3b, 3c and 3d are set so that they are gradually become narrower with increasing distance from the center portion.

    FLUX RECOVERY DEVICE AND SOLDERING DEVICE
    4.
    发明公开
    FLUX RECOVERY DEVICE AND SOLDERING DEVICE 审中-公开

    公开(公告)号：EP3064303A4

    公开(公告)日：2017-07-05

    申请号：EP14857505

    申请日：2014-06-13

    申请人： SENJU METAL INDUSTRY CO

    发明人： HIYAMA TSUTOMU ,  SAITO YUTA

    IPC分类号： B23K3/08 ,  B23K1/008 ,  B23K101/42 ,  H05K3/34

    CPC分类号： B23K3/08 ,  B01D47/06 ,  B01D47/16 ,  B01D53/265 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K3/0638 ,  B23K3/0653 ,  B23K35/362 ,  B23K2201/42

    摘要： To separate gas containing no flux component from a gaseous mixture containing the flux component and recover the flux component. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused. Provided are a first water spray unit (20A) that sprays water into a gaseous mixture containing the flux component; a separation unit (10) that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit (20A), the separation unit using a swirling flow to separate the flux component from the gaseous mixture; a second water spray unit (20B) that forms a precipitation flow inside of the separation unit; and a condensation unit (17) that cools water vapor generated in the separation unit (10) to change the water vapor to water droplets, thereby removing the water vapor.

    REFLOW FURNACE
    8.
    发明公开
    REFLOW FURNACE 审中-公开
    回流

    公开(公告)号：EP1702705A4

    公开(公告)日：2008-12-03

    申请号：EP04807853

    申请日：2004-12-27

    申请人： SENJU METAL INDUSTRY CO

    发明人： NIKAIDO TAKAYUKI ,  HIYAMA TSUTOMU

    IPC分类号： B23K1/008 ,  B23K1/00 ,  B23K3/08 ,  B23K101/42 ,  H05K3/34

    CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K3/08 ,  B23K2201/42

    摘要： [PROBLEMS] A reflow furnace with a conventional flux fume removing device has had difficulty in completely sucking flux fume in the furnace, and in addition, when a purified gas is circulated in the furnace, such a reflow furnace has been unable to stabilize oxygen concentration in the furnace because turbulence of the gas in the furnace causes the outside air to flow into the furnace. [MEANS FOR SOLVING PROBLEMS] A reflow furnace having a suction pipe in the entire heating zone, along a rail on which a transportation conveyor runs, and suction holes are formed inside the suction pipe. In addition, a gas purified outside the furnace is made to flow out at the entrance and exit, and this creates air curtains at the entrance and exit to prevent the outside air from entering into the furnace.