发明公开
EP2943289A1 MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS 审中-公开
ABDECKUNG VON基座ZUM AUFTRAGEN VON SCHUTZSCHICHTEN

MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS
摘要:
A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.
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