公开(公告)号：EP2943289A1

公开(公告)日：2015-11-18

申请号：EP14738293.1

申请日：2014-01-07

申请人： hZo, Inc.

发明人： ASTLE, David, James ,  CHILD, Tyler, Christensen ,  KASAGANI, Vimal, Kumar ,  LOOSE, Cameron, LaMar ,  STEVENS, Blake, LeRoy ,  SORENSON, Max, Ernest

IPC分类号： B05D1/32

CPC分类号： B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/361 ,  B23K26/402 ,  B23K2203/50 ,  C23C14/042 ,  C23C16/042 ,  H01L21/561 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/285 ,  H05K3/288 ,  H05K2203/025 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/163 ,  H01L2924/00

摘要： A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

摘要翻译： 用于从诸如电子设备的基板选择性地去除保护涂层的部分的方法包括从基板去除保护涂层的部分。 去除过程可以包括在特定位置切割保护涂层，然后从衬底去除保护涂层的期望部分，或者其可以包括烧蚀待除去的保护涂层的部分。 还公开了涂层和除去系统。

公开(公告)号：EP2943599A2

公开(公告)日：2015-11-18

申请号：EP14737521.6

申请日：2014-01-08

申请人： hZo, Inc.

发明人： COX, Dana ,  SORENSON, Max ,  CHILD, Tyler, Christensen ,  KASAGANI, Vimal, Kumar ,  LOOSE, Cameron, LaMar

IPC分类号： C23C14/04 ,  C23C16/04 ,  B05B15/04

CPC分类号： B05C21/005 ,  B05C13/00 ,  B05D5/08 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/458 ,  H01L21/6715 ,  H01L21/67333 ,  H01L21/67724 ,  H01L21/682 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for applying a protective coating to electronic device assemblies or other substrates may include a tray capable of holding multiple substrates. The tray can be selectively closed over the substrates. Lower and/or upper tray elements may include pre- formed masks thereon, which masks correspond to locations where protective coating materials should not adhere to the substrate. The masks may include a structural portion and a sealing portion. The structural portion may keep a substrate elevated to maintain an opening or channel through which protective coating materials may be applied to unmasked portions of the substrate. A sealing portion of the mask may engage the substrate to restrict flow of the protective coating material to the masked portion. Each tray may contain multiple substrates. A carrier may support multiple trays. Dozens and potentially hundreds of substrates may be carried by the carrier for simultaneous application of the protective coating.

摘要翻译： 用于将保护涂层施加到电子器件组件或其他基板的设备可以包括能够保持多个基板的托盘。 托盘可以选择性地封闭在基板上。 下托盘元件和/或上托盘元件可以在其上包括预先形成的掩模，该掩模对应于保护涂层材料不应该粘附到衬底的位置。 掩模可以包括结构部分和密封部分。 结构部分可以保持基底升高以保持开口或通道，保护涂层材料可以通过该开口或通道施加到基底的未掩蔽部分。 掩模的密封部分可以接合基板以限制保护涂层材料流向掩模部分。 每个托盘可能包含多个基材。 运营商可能支持多个托盘。 载体可承载数十个和潜在的数百个基底，用于同时施加保护涂层。