发明公开
EP2947893A1 METHOD AND CIRCUIT FOR SCALABLE CROSS POINT SWITCHING USING 3-D DIE STACKING
审中-公开
方法与电路可扩展的交叉点电路中使用3D芯片TAPE LUNG
- 专利标题： METHOD AND CIRCUIT FOR SCALABLE CROSS POINT SWITCHING USING 3-D DIE STACKING
- 专利标题（中）： 方法与电路可扩展的交叉点电路中使用3D芯片TAPE LUNG
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申请号： EP15168439.6申请日： 2015-05-20
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公开(公告)号： EP2947893A1公开(公告)日： 2015-11-25
- 发明人: Schulz, Jeffrey , Hutton, Michael
- 申请人： Altera Corporation
- 申请人地址： 101 Innovation Drive San Jose, CA 95134 US
- 专利权人： Altera Corporation
- 当前专利权人： Altera Corporation
- 当前专利权人地址： 101 Innovation Drive San Jose, CA 95134 US
- 代理机构： Oslo Patentkontor AS
- 优先权： US201414282510 20140520
- 主分类号： H04Q3/55
- IPC分类号： H04Q3/55
摘要：
A cross-point switch having stacked switching dies on a component die is disclosed. The cross point switch allows scalability by adding switching dies. The switching dies include ingress switches that are coupled to multiplexers to a middle stage switches. The inputs and outputs of the ingress switches are connected to the switching interface region via through silicon vias (TSVs). The outputs of the ingress switches are also coupled by TSVs to multiplexers for routing to middle stage switches on a switching die above. If the switching die is stacked on another switching die, the outputs of the ingress switches are coupled by TSVs to the multiplexers for routing to the middle stage switches of the switching die below. By adding switching dies, the switch is configurable to increase the number of ports as well as the width of the ports.
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