发明公开
- 专利标题： POLISHING PAD AND POLISHING METHOD
- 专利标题（中）： 抛光垫上，及研磨方法
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申请号： EP14762618.8申请日： 2014-02-27
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公开(公告)号： EP2974829A1公开(公告)日： 2016-01-20
- 发明人: DOI, Toshiro , SESHIMO, Kiyoshi , TAKAGI, Masataka , KASHIWADA, Hiroshi
- 申请人： Kyushu University, National University Corporation , Fujibo Holdings, Inc.
- 申请人地址： 10-1, Hakozaki 6-chome Higashi-ku Fukuoka-shi, Fukuoka 812-8581 JP
- 专利权人： Kyushu University, National University Corporation,Fujibo Holdings, Inc.
- 当前专利权人： Kyushu University, National University Corporation,Fujibo Holdings, Inc.
- 当前专利权人地址： 10-1, Hakozaki 6-chome Higashi-ku Fukuoka-shi, Fukuoka 812-8581 JP
- 代理机构： V.O.
- 优先权： JP2013049471 20130312
- 国际公布： WO2014141889 20140918
- 主分类号： B24B37/24
- IPC分类号： B24B37/24 ; H01L21/304
摘要：
The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
公开/授权文献
- EP2974829B1 POLISHING PAD AND POLISHING METHOD 公开/授权日：2019-06-19
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