An electronic pump includes a second housing, a rotor part, a stator part and a circuit board. A pump chamber is separated by a partition into a wet chamber allowing a working medium to pass through and at least one dry chamber where there is no working medium passing through, and the rotor part is arranged in the wet chamber. The electronic pump further includes a shaft, a sunken portion is formed at a top portion of the partition, and the shaft and a bottom of the sunken portion are fixed by injection molding. A portion where the rotor part is in contact with the shaft is a cooperation portion of the rotor part, and the cooperation portion is arranged in a cavity of the sunken portion.