发明公开
- 专利标题： VERFAHREN ZUM AUSBILDEN EINER ELEKTRISCH LEITFÄHIGEN STRUKTUR AUF EINEM KUNSTSTOFFSUBSTRAT
- 专利标题（英）： Method for forming an electrically conductive structure on a plastic substrate
- 专利标题（中）： 方法形成导电结构体上的塑料基板
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申请号： EP14796142.9申请日： 2014-11-12
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公开(公告)号： EP3078246A1公开(公告)日： 2016-10-12
- 发明人: FAHLAND, Matthias , GRAFFEL, Benjamin , MATTAUSCH, Gösta , WINCKLER, Falk , WEISS, Stefan , MOSCH, Sindy , JURK, Robert
- 申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- 申请人地址： Hansastraße 27c 80686 München DE
- 专利权人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- 当前专利权人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- 当前专利权人地址： Hansastraße 27c 80686 München DE
- 优先权： DE102013113485 20131204
- 国际公布： WO2015082179 20150611
- 主分类号： H05K3/12
- IPC分类号： H05K3/12
摘要：
The invention relates to a method for forming an electrically conductive structure on a plastic substrate, wherein an ink, which contains electrically conductive solid particles, is printed on the plastic substrate, wherein copper particles are used as electrically conductive solid particles and, after the printing of the ink, only the surface regions of the plastic substrate on which the electrically conductive structure is to be formed are swept over by means of an electron beam having a first energy per unit length within a vacuum chamber, which first energy per unit length causes sintering of the copper particles.
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