发明公开
EP3101688A4 POWER MODULE AND MANUFACTURING METHOD THEREFOR
审中-公开
LEISTUNGSMODUL UND HERSTELLUNGSVERFAHRENDAFÜR
- 专利标题： POWER MODULE AND MANUFACTURING METHOD THEREFOR
- 专利标题（中）： LEISTUNGSMODUL UND HERSTELLUNGSVERFAHRENDAFÜR
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申请号： EP14879282申请日： 2014-01-27
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公开(公告)号： EP3101688A4公开(公告)日： 2017-10-04
- 发明人: SHINTANI HIROSHI , IDE EIICHI , SASAKI KOJI , TANIE HISASHI
- 申请人： HITACHI LTD
- 专利权人： HITACHI LTD
- 当前专利权人： HITACHI LTD
- 优先权： JP2014051643 2014-01-27
- 主分类号： H01L25/07
- IPC分类号： H01L25/07 ; H01L21/48 ; H01L21/54 ; H01L23/00 ; H01L23/043 ; H01L23/24 ; H01L23/36 ; H01L23/367 ; H01L23/373 ; H01L23/40 ; H01L23/433 ; H01L23/473 ; H01L23/498 ; H01L25/18 ; H05K7/20
摘要：
A power module or the like is provided in which lower inductance and miniaturization are achieved. The power module includes: main body units (11 to 13), cooling units (21 to 24) which cool the main body units (11 to 13), busbars (51, 52) connected to power terminals (1i, 1j) of the main body units (11 to 13), a casing (W) in which at least contact parts with the busbars (51, 52) are insulative, and a metal member (30) which supports the casing (W). The metal member (30) tightly contacts the casing (W), thereby forming a box with one side opened. At least the main body units (11 to 13) and the busbars (51, 52) are arranged inside the box. An insulating sealant is provided to fill the inside of the box.
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IPC分类:
