发明公开
EP3111467A2 PROCEDE DE REALISATION D'UNE STRUCTURE PAR ASSEMBLAGE D'AU MOINS DEUX ELEMENTS PAR COLLAGE DIRECT
审中-公开
一种用于生产结构的安排至少两个元件通过直接连接胶
- 专利标题： PROCEDE DE REALISATION D'UNE STRUCTURE PAR ASSEMBLAGE D'AU MOINS DEUX ELEMENTS PAR COLLAGE DIRECT
- 专利标题（英）： Process for producing a structure by assembling at least two elements by direct adhesive bonding
- 专利标题（中）： 一种用于生产结构的安排至少两个元件通过直接连接胶
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申请号： EP15706806.5申请日： 2015-02-26
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公开(公告)号： EP3111467A2公开(公告)日： 2017-01-04
- 发明人: GONDCHARTON, Paul , BENAISSA, Lamine , IMBERT, Bruno , MORICEAU, Hubert
- 申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 申请人地址： 25, Rue Leblanc Bâtiment "Le Ponant D" 75015 Paris FR
- 专利权人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人地址： 25, Rue Leblanc Bâtiment "Le Ponant D" 75015 Paris FR
- 代理机构： Brevalex
- 优先权： FR1451602 20140227
- 国际公布： WO2015128399 20150903
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/768 ; H01L21/98 ; H01L23/485
摘要：
Process for producing a structure by direct adhesive bonding of two elements comprising the production of the elements to be assembled and the assembly of said elements, in which the production of the elements to be assembled comprises the steps: - deposition on a substrate of a TiN layer by physical vapour deposition, - deposition of a copper layer on the TiN layer, and in which the assembly of said elements comprises the steps: - polishing the surfaces of the copper layers intended to come into contact so that they have a roughness of less than 1 nm RMS and hydrophilic properties, - bringing said surfaces into contact, - storing said structure at atmospheric pressure and at ambient temperature.
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