发明公开
- 专利标题: SOLDER DELIVERY SYSTEM
- 专利标题(中): 焊料输送系统
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申请号: EP14884020.0申请日: 2014-02-26
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公开(公告)号: EP3112071A1公开(公告)日: 2017-01-04
- 发明人: KATO, Mitsuaki , FUJITA, Yoji
- 申请人: Fuji Machine Mfg. Co., Ltd.
- 申请人地址: 19, Chausuyama Yamamachi Chiryu-shi, Aichi 472-8686 JP
- 专利权人: Fuji Machine Mfg. Co., Ltd.
- 当前专利权人: Fuji Machine Mfg. Co., Ltd.
- 当前专利权人地址: 19, Chausuyama Yamamachi Chiryu-shi, Aichi 472-8686 JP
- 代理机构: Grünecker Patent- und Rechtsanwälte PartG mbB
- 国际公布: WO2015128967 20150903
- 主分类号: B23K3/06
- IPC分类号: B23K3/06 ; H05K3/34
摘要:
A solder supply system that judges whether solder cup 70 is set on solder supply device 26. In a case in which it is judged that the solder cup is set on the solder supply device, reading a barcode by barcode reader 170 is allowed. In contrast, in a case in which it is judged that the solder cup is not set on the solder supply device, reading a barcode by the barcode reader is restricted. That is, reading a barcode by the barcode reader before the solder cup is set inside outer tube 72 is restricted, while reading a barcode by the barcode reader is allowed when the solder container is set inside outer tube 72. Thus, verification work is only able to be performed for solder cups actually set on solder supply device 26, which prevents operator mistakes and enables verification work of solder containers to be performed appropriately.
公开/授权文献
- EP3112071B1 SOLDER SUPPLY SYSTEM 公开/授权日:2018-07-25
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