- 专利标题: RACK LEVEL PRE-INSTALLED INTERCONNECT FOR ENABLING CABLELESS SERVER/STORAGE/NETWORKING DEPLOYMENT
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申请号: EP15768343申请日: 2015-03-11
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公开(公告)号: EP3123845A4公开(公告)日: 2017-11-15
- 发明人: ADILETTA MATTHEW J , GORIUS AARON , WILDE MYLES , WILKINSON HUGH , KUMAR AMIT Y
- 申请人: INTEL CORP
- 专利权人: INTEL CORP
- 当前专利权人: INTEL CORP
- 优先权: US201414227497 2014-03-27
- 主分类号: H04B1/40
- IPC分类号: H04B1/40 ; H01P3/16
摘要:
Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links. The communication links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
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