发明公开
EP3138196A1 MULTILEVEL DRIVER CIRCUIT FOR HIGH SPEED CHIP-TO-CHIP COMMUNICATIONS
审中-公开
MEHRSTUFIGE TREIBERSCHALTUNGFÜRHOCHSCHNELLE CHIP-TO-CHIP-KOMMUNIKATIONEN
- 专利标题： MULTILEVEL DRIVER CIRCUIT FOR HIGH SPEED CHIP-TO-CHIP COMMUNICATIONS
- 专利标题（中）： MEHRSTUFIGE TREIBERSCHALTUNGFÜRHOCHSCHNELLE CHIP-TO-CHIP-KOMMUNIKATIONEN
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申请号： EP15811965.1申请日： 2015-06-24
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公开(公告)号： EP3138196A1公开(公告)日： 2017-03-08
- 发明人: ULRICH, Roger
- 申请人： Kandou Labs S.A.
- 申请人地址： EPFL Innovation Park, Building I 1015 Lausanne CH
- 专利权人： Kandou Labs S.A.
- 当前专利权人： Kandou Labs S.A.
- 当前专利权人地址： EPFL Innovation Park, Building I 1015 Lausanne CH
- 代理机构： Hoarton, Lloyd Douglas Charles
- 优先权： US201414315306 20140625
- 国际公布： WO2015200506 20151230
- 主分类号： H03H7/40
- IPC分类号： H03H7/40 ; H04L25/49
摘要：
A plurality of driver slice circuits arranged in parallel having a plurality of driver slice outputs, each driver slice circuit having a digital driver input and a driver slice output, each driver slice circuit configured to generate a signal level determined by the digital driver input, and a common output node connected to the plurality of driver slice outputs and a wire of a multi-wire bus, the multi-wire bus having a characteristic transmission impedance matched to an output impedance of the plurality of driver slice circuits arranged in parallel, each driver slice circuit of the plurality of driver slice circuits having an individual output impedance that is greater than the characteristic transmission impedance of the wire of the multi-wire bus.
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