发明公开
- 专利标题: CURABLE SILICONE COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE
- 专利标题(中): 可固化的有机硅组合物和光学半导体装置
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申请号: EP15803624.4申请日: 2015-05-29
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公开(公告)号: EP3153548A1公开(公告)日: 2017-04-12
- 发明人: IIMURA, Tomohiro , TODA, Nohno , INAGAKI, Sawako , FURUKAWA, Haruhiko
- 申请人: Dow Corning Toray Co., Ltd.
- 申请人地址: 5-1, Otemachi 1-chome Chiyoda-ku Tokyo 100-0004 JP
- 专利权人: Dow Corning Toray Co., Ltd.
- 当前专利权人: Dow Corning Toray Co., Ltd.
- 当前专利权人地址: 5-1, Otemachi 1-chome Chiyoda-ku Tokyo 100-0004 JP
- 代理机构: Fyfe, Fiona Allison Watson
- 优先权: JP2014114513 20140603
- 国际公布: WO2015186322 20151210
- 主分类号: C08L83/07
- IPC分类号: C08L83/07 ; C08L83/05 ; C08L83/06 ; H01L23/29 ; H01L23/31 ; H01L33/52
摘要:
A curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) an adhesion promoter represented by the average unit formula; and (D) a hydrosilylation reaction catalyst. Provided is a curable silicone composition for forming a transparent cured product having high adhesion to a substrate, and an optical semiconductor device having excellent reliability made using the composition.
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