发明公开
- 专利标题: SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME
- 专利标题(中): 半导体器件及其制造方法
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申请号: EP15811392.8申请日: 2015-06-17
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公开(公告)号: EP3159932A1公开(公告)日: 2017-04-26
- 发明人: SUZUKI, Mariko , SAKAI, Tadashi
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: 1-1 Shibaura 1-chome Minato-ku Tokyo 105-8001 JP
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: 1-1 Shibaura 1-chome Minato-ku Tokyo 105-8001 JP
- 代理机构: Moreland, David
- 优先权: JP2014128021 20140623
- 国际公布: WO2015198950 20151230
- 主分类号: H01L29/861
- IPC分类号: H01L29/861 ; H01L21/205 ; H01L21/28 ; H01L21/329 ; H01L29/06 ; H01L29/16 ; H01L29/868
摘要:
According to one embodiment, a semiconductor device includes an n-type semiconductor layer containing diamond, a first electrode including a first portion, an intermediate layer, and a p-type semiconductor layer containing diamond. The intermediate layer contains at least any of a carbide, graphite, graphene, and amorphous carbon. The carbide contains at least any of Ti, Si, Al, W, Ni, Cr, Ca, Li, Ru, Mo, Zr, Sr, Co, Rb, K, Cu, and Na. The intermediate layer includes a first region provided between the first portion and the n-type semiconductor layer, and a second region provided around the first region when projected on a plane perpendicular to a direction from the n-type semiconductor layer to the first electrode. The second region does not overlap the first portion, and is continuous with the first region.
公开/授权文献
- EP3159932B1 DIAMOND SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME 公开/授权日:2021-09-01
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