发明公开
EP3167482A1 PROCESS FOR MANUFACTURING OF A THICK COPPER WIRE FOR BONDING APPLICATIONS
审中-公开
制造用于粘结应用的厚铜线的方法
- 专利标题： PROCESS FOR MANUFACTURING OF A THICK COPPER WIRE FOR BONDING APPLICATIONS
- 专利标题（中）： 制造用于粘结应用的厚铜线的方法
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申请号： EP15721617.7申请日： 2015-04-28
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公开(公告)号： EP3167482A1公开(公告)日： 2017-05-17
- 发明人: MILKE, Eugen , AINOUZ, Larbi , PRENOSIL, Peter
- 申请人： Heraeus Deutschland GmbH & Co. KG
- 申请人地址： Heraeusstr. 12-14 63450 Hanau DE
- 专利权人： Heraeus Deutschland GmbH & Co. KG
- 当前专利权人： Heraeus Deutschland GmbH & Co. KG
- 当前专利权人地址： Heraeusstr. 12-14 63450 Hanau DE
- 代理机构： Heraeus IP
- 优先权： EP14176650 20140711
- 国际公布： WO2016005068 20160114
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; C22C9/00 ; C22F1/08 ; H01B1/02
摘要：
A process for manufacturing a bonding wire containing a core having a surface. The core contains ≧98.0% copper and has a cross sectional area of 75,00 to 600,000 μm2 and an elastic limit RP0.2 (yield strength) of 40 to 95 N/mm2. The process involves (a) providing a copper core precursor; (b) drawing the precursor until a final diameter of the wire core is reached; and (c) annealing the drawn wire at a minimum annealing temperature of 650 to 1000° C. through its entire cross section for a minimum annealing time of 4 seconds to 2 hours.
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