发明公开
EP3186413A1 COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS
审中-公开
组合物，其用途和用于电镀金含有层的方法
- 专利标题： COMPOSITION, USE THEREOF AND METHOD FOR ELECTRODEPOSITING GOLD CONTAINING LAYERS
- 专利标题（中）： 组合物，其用途和用于电镀金含有层的方法
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申请号： EP15753055.1申请日： 2015-08-21
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公开(公告)号： EP3186413A1公开(公告)日： 2017-07-05
- 发明人: BREITFELDER, Jana , RÜTHER, Robert , KURTZ, Olaf
- 申请人： Atotech Deutschland GmbH
- 申请人地址： Erasmusstraße 20 10553 Berlin DE
- 专利权人： Atotech Deutschland GmbH
- 当前专利权人： Atotech Deutschland GmbH
- 当前专利权人地址： Erasmusstraße 20 10553 Berlin DE
- 优先权： EP14182083 20140825
- 国际公布： WO2016030290 20160303
- 主分类号： C25D3/48
- IPC分类号： C25D3/48 ; C25D21/18 ; C25D3/62
摘要：
The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto triazole as additive. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.
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