- 专利标题: PACKAGING SYSTEM AND PACKAGING METHOD
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申请号: EP15762466申请日: 2015-03-17
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公开(公告)号: EP3211685A4公开(公告)日: 2018-05-30
- 发明人: YANG JIUXIA , BAI FENG , ZHANG LIANG , CHEN XU , XIAO ANG
- 申请人: BOE TECHNOLOGY GROUP CO LTD , BEIJING BOE OPTOELECTRONICS TECH CO LTD
- 专利权人: BOE TECHNOLOGY GROUP CO LTD,BEIJING BOE OPTOELECTRONICS TECH CO LTD
- 当前专利权人: BOE TECHNOLOGY GROUP CO LTD,BEIJING BOE OPTOELECTRONICS TECH CO LTD
- 优先权: CN201410571923 2014-10-23
- 主分类号: H01L51/56
- IPC分类号: H01L51/56 ; H01L21/67 ; H01L27/32
摘要:
The present disclosure discloses an encapsulation system and an encapsulation method, the encapsulation system comprising a thickness detection unit, an output control unit and an energy output unit, the thickness detection unit being connected with the output control unit, and the output control unit being connected with the energy output unit. The thickness detection unit is configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated and generate corresponding thickness information. The output control unit is configured to generate corresponding output control information depending on the thickness information. The energy output unit is configured to output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating the encapsulant. With the technical solution of the present disclosure, the encapsulant can be heated properly based on its actual state such that the encapsulant at the to-be-heated location can all sufficiently melt, which effectively improves the sealing of the product.
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