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    VACUUM ABSORPTION SYSTEM AND METHOD OF PACKAGING MOTHER BOARD AND PACKAGING DEVICE
    1.
    发明公开
    VACUUM ABSORPTION SYSTEM AND METHOD OF PACKAGING MOTHER BOARD AND PACKAGING DEVICE 审中-公开

    公开(公告)号：EP3211664A4

    公开(公告)日：2018-06-20

    申请号：EP15787886

    申请日：2015-04-16

    申请人： BOE TECHNOLOGY GROUP CO LTD ,  BEIJING BOE OPTOELECTRONICS TECH CO LTD

    发明人： YANG JIUXIA ,  BAI FENG

    IPC分类号： H01L21/683 ,  H01L21/60 ,  H01L21/68

    CPC分类号： H01L21/6838 ,  H01L21/67126 ,  H01L21/67259 ,  H01L21/68 ,  H01L51/56

    摘要： The present invention provides a vacuum adsorption system and an adsorption method thereof, and a packaging device for a mother substrate to be packaged, and belongs to the field of substrate packaging technology. The vacuum adsorption system used for the mother substrate to be packaged according to the present invention includes: a vacuum adsorption platform; a carrying platform, which is provided on the vacuum adsorption platform and edges thereof are sealed with edges of the vacuum adsorption platform, configured to carrying the mother substrate to be packaged and provided thereon with a plurality of adsorption units, the adsorption units being used for adsorbing, in cooperation with the vacuum adsorption platform, the mother substrate to be packaged so as to fix the mother substrate to be packaged; a detection unit, configured to detect positional relationships between the adsorption units on the carrying platform and packaging areas on the mother substrate to be packaged; and an adjustment unit, configured to adjust the position of the carrying platform when the detection unit detects that the positions of the adsorption units on the carrying platform are overlapped with the packaging areas on the mother substrate to be packaged, so that positions of at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas on the mother substrate to be packaged.

    MOBILE DEVICE PROTECTION APPARATUS
    6.
    发明公开
    MOBILE DEVICE PROTECTION APPARATUS 审中-公开

    公开(公告)号：EP3190451A4

    公开(公告)日：2018-05-16

    申请号：EP15832863

    申请日：2015-07-03

    申请人： BOE TECHNOLOGY GROUP CO LTD ,  BEIJING BOE OPTOELECTRONICS TECH CO LTD

    发明人： YANG JIUXIA ,  BAI FENG ,  WANG RUIYONG

    IPC分类号： G02F1/133 ,  H02J7/00 ,  H02J7/35 ,  H04M1/02

    CPC分类号： H02J7/35 ,  H02J7/0044 ,  H04M1/0202 ,  H04M1/185 ,  H04M1/21 ,  Y02E10/566

    摘要： A protective device of mobile equipment is provided. The protective device of mobile equipment comprises: a bottom plate (1) and a protective cover plate (2) connected with and opposite to the bottom plate (1). The protective cover plate (2) is provided with a light collecting layer (3) and a photovoltaic layer (4). The light collecting layer (3) is configured to refract the incident light and guide it into the photovoltaic layer (4). The photovoltaic layer (4) is configured to convert energy of the incident light guided by the light collecting layer into electric energy. The light collecting layer (3) is used to guide the incident light to the photovoltaic layer (4), so that the utilization rate of the incident light is improved, and the capability of the protective device of mobile equipment with solar charging function supplying power to the mobile equipment and continuously charging the mobile equipment is enhanced.

    PACKAGING SYSTEM AND PACKAGING METHOD
    9.
    发明公开
    PACKAGING SYSTEM AND PACKAGING METHOD 审中-公开

    公开(公告)号：EP3211685A4

    公开(公告)日：2018-05-30

    申请号：EP15762466

    申请日：2015-03-17

    申请人： BOE TECHNOLOGY GROUP CO LTD ,  BEIJING BOE OPTOELECTRONICS TECH CO LTD

    发明人： YANG JIUXIA ,  BAI FENG ,  ZHANG LIANG ,  CHEN XU ,  XIAO ANG

    IPC分类号： H01L51/56 ,  H01L21/67 ,  H01L27/32

    CPC分类号： H01L22/26 ,  B23K26/206 ,  G01B11/0616 ,  G01B21/02 ,  H01L22/10 ,  H01L22/12 ,  H01L27/32 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/56 ,  H01L2251/558

    摘要： The present disclosure discloses an encapsulation system and an encapsulation method, the encapsulation system comprising a thickness detection unit, an output control unit and an energy output unit, the thickness detection unit being connected with the output control unit, and the output control unit being connected with the energy output unit. The thickness detection unit is configured to detect a thickness of an encapsulant at a to-be-heated location in a component to be encapsulated and generate corresponding thickness information. The output control unit is configured to generate corresponding output control information depending on the thickness information. The energy output unit is configured to output, depending on the output control information, to the encapsulant at the to-be-heated location energy for heating the encapsulant. With the technical solution of the present disclosure, the encapsulant can be heated properly based on its actual state such that the encapsulant at the to-be-heated location can all sufficiently melt, which effectively improves the sealing of the product.