发明公开
- 专利标题： VIA STRUCTURE FOR OPTIMIZING SIGNAL POROSITY
- 专利标题（中）： VIA结构优化信号孔径
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申请号： EP15779164.1申请日： 2015-10-05
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公开(公告)号： EP3213346A1公开(公告)日： 2017-09-06
- 发明人: MENG, Xiongfei , CHUNG, Joon Hyung , PAN, Yuancheng Christopher
- 申请人： Qualcomm Incorporated
- 申请人地址： 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 专利权人： Qualcomm Incorporated
- 当前专利权人： Qualcomm Incorporated
- 当前专利权人地址： 5775 Morehouse Drive San Diego, CA 92121-1714 US
- 代理机构： Klang, Alexander H.
- 优先权： US201462072966P 20141030; US201514744634 20150619
- 国际公布： WO2016069205 20160506
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L23/528 ; H01L23/66
摘要：
An apparatus including a conductive stack structure includes an M
x layer interconnect on an M
x layer and extending in a first direction on a first track, an M
y layer interconnect on an M
y layer in which the My layer is a lower layer than the M
x layer, a first via stack coupled between the M
x layer interconnect and the M
y layer interconnect, a second via stack coupled between the M
x layer interconnect and the My layer interconnect, a second M
x layer interconnect extending in the first direction on a track immediately adjacent to the first track, and a third M
x layer interconnect extending in the first direction on a track immediately adjacent to the first track. The M
x layer interconnect is between the second M
x layer interconnect and the third M
x layer interconnect. The second M
x layer interconnect and the third M
x layer interconnect are uncoupled to each other.
x layer interconnect on an M
x layer and extending in a first direction on a first track, an M
y layer interconnect on an M
y layer in which the My layer is a lower layer than the M
x layer, a first via stack coupled between the M
x layer interconnect and the M
y layer interconnect, a second via stack coupled between the M
x layer interconnect and the My layer interconnect, a second M
x layer interconnect extending in the first direction on a track immediately adjacent to the first track, and a third M
x layer interconnect extending in the first direction on a track immediately adjacent to the first track. The M
x layer interconnect is between the second M
x layer interconnect and the third M
x layer interconnect. The second M
x layer interconnect and the third M
x layer interconnect are uncoupled to each other.
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