发明公开
- 专利标题: ROUNDNESS MEASUREMENT DEVICE
- 专利标题(中): 圆度测量装置
-
申请号: EP16743094.1申请日: 2016-01-12
-
公开(公告)号: EP3239654A1公开(公告)日: 2017-11-01
- 发明人: TAKANASHI, Ryo
- 申请人: Tokyo Seimitsu Co., Ltd.
- 申请人地址: 2968-2, Ishikawa-machi Hachioji-shi Tokyo 192-8515 JP
- 专利权人: Tokyo Seimitsu Co., Ltd.
- 当前专利权人: Tokyo Seimitsu Co., Ltd.
- 当前专利权人地址: 2968-2, Ishikawa-machi Hachioji-shi Tokyo 192-8515 JP
- 代理机构: Grünecker Patent- und Rechtsanwälte PartG mbB
- 优先权: JP2015014383 20150128
- 国际公布: WO2016121490 20160804
- 主分类号: G01B21/30
- IPC分类号: G01B21/30 ; G01B5/20 ; G01B21/00 ; G01B21/20
摘要:
A roundness measurement device 1 according to the present invention includes a base 10, a stage 12 provided on the base 10 and configured to place a workpiece W thereon, a column 14 elected on the base 10, a carriage 16 supported movably along the column 14, a turning arm 18 supported by the carriage 16 turnably around a pivot axis in a radial direction (left-right direction), a radial direction moving arm 20 supported movably in the radial direction, and a detector holder 22 fixed to a tip end of the radial direction moving arm 20. A detector 24 is held by the detector holder 22, and a position of the detector in the radial direction is adjusted by movement of the radial direction moving arm 20 in the radial direction.
公开/授权文献
- EP3239654B1 ROUNDNESS MEASUREMENT DEVICE 公开/授权日:2018-11-14
信息查询