A phased array ultrasonic transducer (100;200;300;400;500) includes a bonding wire structure (502;700;1100;1200;1300;1400), a damping material (124;516), a plurality of ultrasonic transducers (102,104,106;210;310;410;910), and a printed circuit board (114). The bonding wire structure includes a plurality of bonding wire elements (504,506,508;600). The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.