发明公开
- 专利标题: THERMAL ENCLOSURE
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申请号: EP17178078.6申请日: 2017-06-27
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公开(公告)号: EP3264509A3公开(公告)日: 2018-03-07
- 发明人: EICKHOFF, Steven J. , KLEIN, Jeffrey Michael , ZINS, Christopher J.
- 申请人: Honeywell International Inc.
- 申请人地址: 115 Tabor Road M/S 4D3 P.O.Box 377 Morris Plains, NJ 07950 US
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: 115 Tabor Road M/S 4D3 P.O.Box 377 Morris Plains, NJ 07950 US
- 代理机构: Houghton, Mark Phillip
- 优先权: US201662356616P 20160630; US201715632778 20170626
- 主分类号: H01M8/2475
- IPC分类号: H01M8/2475 ; F16L59/065 ; B32B1/02 ; B32B3/08 ; B32B5/02 ; B32B5/16 ; B32B17/10 ; E04B1/76
摘要:
A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.
公开/授权文献
- EP3264509B1 THERMAL ENCLOSURE 公开/授权日:2022-03-02
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