MODULATED THERMAL CONDUCTANCE THERMAL ENCLOSURE
    4.
    发明公开
    MODULATED THERMAL CONDUCTANCE THERMAL ENCLOSURE 审中-公开
    调制的热传导热封套

    公开(公告)号:EP3264510A1

    公开(公告)日:2018-01-03

    申请号:EP17178079.4

    申请日:2017-06-27

    IPC分类号: H01M8/2475

    摘要: A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material disposed in the gap.

    摘要翻译: 本发明提供一种隔热装置,其特征在于,具备:第一板;第二板,隔着所述第一板与所述第二板而隔着所述第一板而嵌合;多孔材料,配置于所述板之间的间隙;密封层,配置于所述第一板与所述第二板之间 使得多孔材料在低于环境的压力下与周围环境密封,并且蒸气产生材料设置在间隙中。