发明公开
- 专利标题: METHOD FOR MANUFACTURING RESIN MOLD ASSEMBLY
- 专利标题(中): 制造树脂模具组件的方法
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申请号: EP17199060.9申请日: 2010-05-28
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公开(公告)号: EP3296082A1公开(公告)日: 2018-03-21
- 发明人: Hokoda, Kazuaki , Zaitsu, Yoshihiro , Umeyama, Tatsuya
- 申请人: STANLEY ELECTRIC CO., LTD.
- 申请人地址: 2-9-13, Nakameguro Meguro-ku Tokyo 153-8636 JP
- 专利权人: STANLEY ELECTRIC CO., LTD.
- 当前专利权人: STANLEY ELECTRIC CO., LTD.
- 当前专利权人地址: 2-9-13, Nakameguro Meguro-ku Tokyo 153-8636 JP
- 代理机构: Emde, Eric
- 优先权: JP2009129901 20090529; JP2009237927 20091015; JP2009247402 20091028
- 主分类号: B29C65/16
- IPC分类号: B29C65/16 ; F21V17/00
摘要:
In manufacturing a resin mold assembly, a first weld region of a light transmitting resin member (22) and a second weld region of a light absorbing resin member (21) are disposed facing each other, the first weld region of the light transmitting resin member (22) and the second weld region of the light absorbing resin member (21) are brought into pressed state in mutually facing direction, and a plurality of laser beams (12s) is scanned over a whole area of the second weld region, and repetitively radiated on the second weld region to heat and melt a whole of the first and second weld regions simultaneously, thereby welding the light transmitting resin member (22) and the light absorbing resin member (21).
公开/授权文献
- EP3296082B1 METHOD FOR MANUFACTURING RESIN MOLD ASSEMBLY 公开/授权日:2020-02-19
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