发明公开
EP3304592A1 MICROWAVE INTEGRATED CIRCUIT (MMIC) DAMASCENE ELECTRICAL INTERCONNECT FOR MICROWAVE ENERGY TRANSMISSION
审中-公开
微波集成电路（MMIC）DAMASCENE电气互连用于微波能量传输
- 专利标题： MICROWAVE INTEGRATED CIRCUIT (MMIC) DAMASCENE ELECTRICAL INTERCONNECT FOR MICROWAVE ENERGY TRANSMISSION
- 专利标题（中）： 微波集成电路（MMIC）DAMASCENE电气互连用于微波能量传输
-
申请号： EP16730939.2申请日： 2016-05-31
-
公开(公告)号： EP3304592A1公开(公告)日： 2018-04-11
- 发明人: LAROCHE, Jeffrey R. , BETTENCOURT, John P. , KAZIOR, Thomas E. , IP, Kelly P.
- 申请人： Raytheon Company
- 申请人地址： 870 Winter Street Waltham, MA 02451-1449 US
- 专利权人： Raytheon Company
- 当前专利权人： Raytheon Company
- 当前专利权人地址： 870 Winter Street Waltham, MA 02451-1449 US
- 代理机构： Carpmaels & Ransford LLP
- 优先权： US201514733465 20150608
- 国际公布： WO2016200638 20161215
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/522 ; H01L23/532 ; H01L21/768
摘要：
A semiconductor structure having a semiconductor layer having an active device therein. A dielectric structure is disposed over the semiconductor layer, such dielectric structure having open ended trench therein. An electrical interconnect level is disposed in the trench and electrically connected to the active device. A plurality of stacked metal layers is disposed in the trench. The stacked metal layers have disposed on bottom and sidewalls thereof conductive barrier metal layers.
公开/授权文献
信息查询
IPC分类:
