发明公开
EP3308396A1 LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING
审中-公开
带导电夹片的导线架，用于安装具有减少夹式移位的半导体裸片
- 专利标题： LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING
- 专利标题（中）： 带导电夹片的导线架，用于安装具有减少夹式移位的半导体裸片
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申请号： EP16807990.3申请日： 2016-05-11
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公开(公告)号： EP3308396A1公开(公告)日： 2018-04-18
- 发明人: DING, Hui-Ying , WANG, Pengnian , YU, Tao , LIU, Jun-Feng , BAI, Jun-Kai , PENG, Chih-Ping
- 申请人： Vishay General Semiconductor LLC
- 申请人地址： 150 Motor Parkway Hauppauge, NY 11788 US
- 专利权人： Vishay General Semiconductor LLC
- 当前专利权人： Vishay General Semiconductor LLC
- 当前专利权人地址： 150 Motor Parkway Hauppauge, NY 11788 US
- 代理机构： Knowles, James Atherton
- 优先权： US201514735229 20150610
- 国际公布： WO2016200534 20161215
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/433 ; H01L23/31 ; H01L23/64 ; H01L33/48
摘要：
A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.
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