- 专利标题: ELECTRONIC DEVICE INCLUDING CONDUCTIVE HOUSING
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申请号: EP17203540.4申请日: 2017-11-24
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公开(公告)号: EP3327863A1公开(公告)日: 2018-05-30
- 发明人: Song, Keum Su , Kim, Ji Won , Park, Se Ho , Lee, Ki Tae , Lee, Chang Ho , Cho, Chi Hyun
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 16677 KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: 129, Samsung-ro Yeongtong-gu Suwon-si Gyeonggi-do 16677 KR
- 代理机构: Nederlandsch Octrooibureau
- 优先权: KR20160157363 20161124
- 主分类号: H01Q7/00
- IPC分类号: H01Q7/00 ; H04B5/00
摘要:
An electronic device is provided. The electronic device includes a housing and a first coil disposed in the housing and wound around a space formed inside. The housing includes a front cover and a rear cover. The rear cover includes a hole located in a first region of the rear cover that corresponds to the space of the first coil, a first slit that extends from an edge of the rear cover to the hole, and a second slit spaced apart from the first slit and extending from the edge. One end of the second slit is located in a second region of the rear cover that corresponds to the first coil. In addition, various other embodiments recognized through the present specification are possible.
公开/授权文献
- EP3327863B1 ELECTRONIC DEVICE INCLUDING CONDUCTIVE HOUSING 公开/授权日:2021-08-11
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