NON-CONTACT COMMUNICATION MEDIUM
    4.
    发明公开

    公开(公告)号:EP4462598A1

    公开(公告)日:2024-11-13

    申请号:EP22918903.0

    申请日:2022-12-28

    Inventor: KATAOKA Shin

    Abstract: The present invention is a contactless communication medium (1) including an IC module (10) and a plurality of metal plates (20). Each of the plurality of metal plates (20) has a through hole (21) and a slit (22). At least two or more metal plates (20) are laminated via an insulating layer (30). The metal plates (20) include a first metal plate (20A) and a second metal plate (20B). The second metal plate (20B) extends across the slit (22) of the first metal plate (20A) in plan view of the first metal plate (20A), and adds electrostatic capacitance between portions of the slit (22) of the first metal plate (20A).

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