- 专利标题: PRIMER COMPOSITIONS FOR INJECTION MOLDING
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申请号: EP16770235.6申请日: 2016-09-14
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公开(公告)号: EP3356473A1公开(公告)日: 2018-08-08
- 发明人: NOLAN, Darren , KNEAFSEY, Brendan , DEEGAN, Brian , LOANE, Mark
- 申请人: Henkel IP & Holding GmbH
- 申请人地址: Henkelstrasse 67 40589 Düsseldorf DE
- 专利权人: Henkel IP & Holding GmbH
- 当前专利权人: Henkel IP & Holding GmbH
- 当前专利权人地址: Henkelstrasse 67 40589 Düsseldorf DE
- 代理机构: Henkel IP Department
- 优先权: GB201517106 20150928
- 国际公布: WO2017055089 20170406
- 主分类号: C09D4/06
- IPC分类号: C09D4/06 ; C09D5/00 ; C08F285/00 ; C08F287/00 ; C09D153/02
摘要:
A curable primer composition comprising: (a) a curable component such as methacrylate; (b) a cure initiating component; and (c) a polymer material selected from the group consisting of: (i) block polymers represented by S-A-S where S is polystyrene and A stands for a polymer or copolymer formed from one or more of ethylene, propylene, butylene, and styrene, which are optionally substituted with carboxylic acid or maleic anhydride; provided that when A comprises styrene then A is a copolymer of styrene with at least one of ethylene, propylene and butylene, and is optionally substituted with carboxylic acid or maleic anhydride; and (ii) polystyrene-poly(ethylene-propylene) (“SEP”); and (iii) any combination of said polymer materials. The composition is applied to a part then photocured. It is dry to touch. Thereafter a thermoplastic material such as a polyolefin is overmolded (e.g. injection molded) over the applied composition. It enhances bond strength of the polyolefin to the part.
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