- 专利标题： SEMI-AROMATIC POLYAMIDE RESIN, METHOD FOR PREPARING SAME, AND POLYAMIDE MOLDING COMPOSITION CONSISTING OF SAME
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申请号： EP17809166.6申请日： 2017-06-09
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公开(公告)号： EP3375821A1公开(公告)日： 2018-09-19
- 发明人: ZHANG, Chuanhui , CAO, Min , JIANG, Sujun , HUANG, Xianbo , MAI, Jiehong , LONG, Jieming , SHI, Zhenguo , YAN, Kun , FAN, Liming
- 申请人： Zuhai Vanteque Specialty Engineering Plastics Co., Ltd. , Kingfa Sci. & Tech. Co., Ltd.
- 申请人地址： No. 177, Petrochemical Road 9, Nanshui Town Jinwan District Zhuhai Guangdong 519050 CN
- 专利权人： Zuhai Vanteque Specialty Engineering Plastics Co., Ltd.,Kingfa Sci. & Tech. Co., Ltd.
- 当前专利权人： Zuhai Vanteque Specialty Engineering Plastics Co., Ltd.,Kingfa Sci. & Tech. Co., Ltd.
- 当前专利权人地址： No. 177, Petrochemical Road 9, Nanshui Town Jinwan District Zhuhai Guangdong 519050 CN
- 代理机构： Haseltine Lake LLP
- 优先权： CN201710040792 20170120
- 国际公布： WO2018133295 20180726
- 主分类号： C08L77/06
- IPC分类号： C08L77/06
摘要：
The present invention discloses a semiaromatic polyamide resin, a preparation method thereof, and a polyamide molding composition consisting of the same, which consists of following components:
(A) 20 to 95 wt% of a PA10T homopolymer derived from 1,10-decanediamine and terephthalic acid; and
(B) 5 to 80 wt% of a PA6T homopolymer derived from 1,6-hexanediamine and terephthalic acid.
Particularly, (A) + (B) =100 wt%.
In the present invention, by adding a certain amount of the PA10T homopolymer into the PA6T homopolymer, a melting point of the PA6T homopolymer can be significantly decreased to be below a decomposition temperature, and thereby a processability of the PA6T homopolymer is improved. The prepared semiaromatic polyamide resin has a decreased melting point, and may be processed normally. The polyamide molding composition consisting of the semiaromatic polyamide resin has a good processability, and has excellent surface properties.
(A) 20 to 95 wt% of a PA10T homopolymer derived from 1,10-decanediamine and terephthalic acid; and
(B) 5 to 80 wt% of a PA6T homopolymer derived from 1,6-hexanediamine and terephthalic acid.
Particularly, (A) + (B) =100 wt%.
In the present invention, by adding a certain amount of the PA10T homopolymer into the PA6T homopolymer, a melting point of the PA6T homopolymer can be significantly decreased to be below a decomposition temperature, and thereby a processability of the PA6T homopolymer is improved. The prepared semiaromatic polyamide resin has a decreased melting point, and may be processed normally. The polyamide molding composition consisting of the semiaromatic polyamide resin has a good processability, and has excellent surface properties.
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