- 专利标题: SENSOR CHIP AND ELECTRONIC DEVICE
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申请号: EP17809056.9申请日: 2017-11-15
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公开(公告)号: EP3549169A1公开(公告)日: 2019-10-09
- 发明人: TANAKA, Akira , OTAKE, Yusuke , WAKANO, Toshifumi
- 申请人: Sony Semiconductor Solutions Corporation
- 申请人地址: 4-14-1, Asahi-cho Atsugi-shi, Kanagawa 243-0014 JP
- 专利权人: Sony Semiconductor Solutions Corporation
- 当前专利权人: Sony Semiconductor Solutions Corporation
- 当前专利权人地址: 4-14-1, Asahi-cho Atsugi-shi, Kanagawa 243-0014 JP
- 代理机构: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB
- 优先权: JP2016231585 20161129
- 国际公布: WO2018101033 20180607
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H01L31/107
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