发明公开
- 专利标题： HEAT DISSIPATION MODULE
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申请号： EP19183708.7申请日： 2019-07-01
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公开(公告)号： EP3591233A1公开(公告)日： 2020-01-08
- 发明人: Lin, Kuang-Hua , HSIEH, Cheng-Wen , LIAO, Wen-Neng
- 申请人： Acer Incorporated
- 申请人地址： 8F, No. 88, Sec. 1 Xintai 5th Road Xizhi District New Taipei City 221 TW
- 专利权人： Acer Incorporated
- 当前专利权人： Acer Incorporated
- 当前专利权人地址： 8F, No. 88, Sec. 1 Xintai 5th Road Xizhi District New Taipei City 221 TW
- 代理机构： 2K Patentanwälte Blasberg Kewitz & Reichel
- 优先权： TW107122836 20180702
- 主分类号： F04D17/16
- IPC分类号： F04D17/16 ; F04D25/06 ; F04D25/16 ; F04D27/00 ; F04D29/28
摘要：
A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.
公开/授权文献
- EP3591233B1 HEAT DISSIPATION MODULE 公开/授权日：2022-08-31
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