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    THERMAL DISSIPATION MODULE
    2.
    发明公开
    THERMAL DISSIPATION MODULE 审中-公开
    WÄRMEABLEITUNGSMODUL

    公开(公告)号：EP3144772A1

    公开(公告)日：2017-03-22

    申请号：EP16186964.9

    申请日：2016-09-02

    申请人： Acer Incorporated

    发明人： Wang, Yung-Chih ,  Ke, Jau-Han ,  LIAO, Wen-Neng ,  HSIEH, Cheng-Wen

    IPC分类号： G06F1/20

    摘要： A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator thermally contacts the heat source and absorbs heat generated from the heat source. The evaporator has a chamber connected to the pipe to form a loop, and the working fluid is filled in the loop. A structure of the chamber located at a connection portion between the chamber and the pipe gradually converges towards the pipe in relation to other structure of the chamber.

    摘要翻译： 提供了一种用于电子设备的散热模块。 电子设备具有热源。 散热模块包括蒸发器，管道和工作流体。 蒸发器热接触热源并吸收从热源产生的热量。 蒸发器具有连接到管道的腔室以形成环路，并且工作流体填充在环路中。 位于腔室和管子之间的连接部分处的室的结构相对于腔室的其它结构逐渐朝向管道会聚。

    HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME
    4.
    发明公开
    HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME 有权
    散热组件及使用该组件的电子装置

    公开(公告)号：EP3168709A1

    公开(公告)日：2017-05-17

    申请号：EP16200283.6

    申请日：2014-03-25

    申请人： Acer Incorporated

    发明人： HSIEH, Cheng-Wen ,  LIAO, Wen-Neng

    IPC分类号： G06F1/20

    摘要： A heat dissipating assembly (200) suited for an electronic device (10) is provided. The electronic device has at least one heat source (400). The heat dissipating assembly includes a first tube (210), a second tube (220), and a fluid (300). The first tube has an inlet (E1) and an outlet (E2), wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube (210). Two opposite ends of the second tube (220) are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid (300) is filled in the closed loop. The fluid in the first tube (210) transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube (220) for heat dissipating. An electronic device is also provided.

    摘要翻译： 提供了一种适用于电子设备（10）的散热组件（200）。 电子设备具有至少一个热源（400）。 散热组件包括第一管（210），第二管（220）和流体（300）。 第一管具有入口（E1）和出口（E2），其中入口的孔径小于出口的孔径。 从热源产生的热量被传递到第一管（210）。 第二管（220）的两个相对端连接到入口和出口，使得第一和第二管形成闭环。 流体（300）填充在闭环中。 从入口向出口转移的第一管（210）中的流体吸收热量并传递到第二管（220）以进行散热。 还提供了电子设备。

    HEAT DISSIPATION MODULE
    6.
    发明公开
    HEAT DISSIPATION MODULE 审中-公开

    公开(公告)号：EP3591233A1

    公开(公告)日：2020-01-08

    申请号：EP19183708.7

    申请日：2019-07-01

    申请人： Acer Incorporated

    发明人： Lin, Kuang-Hua ,  HSIEH, Cheng-Wen ,  LIAO, Wen-Neng

    IPC分类号： F04D17/16 ,  F04D25/06 ,  F04D25/16 ,  F04D27/00 ,  F04D29/28

    摘要： A heat dissipation module including a first fan and a second fan is provided. The first fan has a first hub and a plurality of first fan blades disposed on the first hub. The second fan has a second hub and a plurality of second fan blades disposed on the second hub. Herein the first hub and the second hub are movably connected to each other in an axial direction such that the first fan and the second fan coincide or are separated from each other.

    LATTICE BOILER EVAPORATOR
    7.
    发明公开
    LATTICE BOILER EVAPORATOR 审中-公开
    格子锅炉蒸发器

    公开(公告)号：EP3290850A1

    公开(公告)日：2018-03-07

    申请号：EP17175586.1

    申请日：2017-06-12

    申请人： Acer Incorporated

    发明人： WANG, Yung-Chih ,  HSIEH, Cheng-Wen ,  LIAO, Wen-Neng ,  KE, Jau-Han

    IPC分类号： F28D15/02 ,  H01L23/34

    CPC分类号： F28D15/025 ,  B23P15/26 ,  F28D15/0266 ,  H01L23/427

    摘要： An evaporator suitable for a thermal dissipation module. The thermal dissipation module includes a tube or pipe and fluid. The evaporator includes a housing, a first heat dissipation structure and a second heat dissipation structure disposed in a sealed chamber of the housing. The chamber is configured to communicate with the pipe, and the fluid is configured to flow in the pipe and the chamber. The first heat dissipation structure and a second heat dissipation structure provide a plurality of fluid flow passages through which the fluid flows and evaporates. A manufacturing method of the evaporator is also disclosed.

    摘要翻译： 适用于散热模块的蒸发器。 散热模块包括管或管道和流体。 蒸发器包括壳体，设置在壳体的密封腔室中的第一散热结构和第二散热结构。 腔室构造成与管道连通，并且流体构造成在管道和腔室中流动。 第一散热结构和第二散热结构提供多个流体流动通道，流体通过该多个流体流动通道流动并蒸发。 还公开了蒸发器的制造方法。

    FAN MODULE AND ELECTRONIC DEVICE USING THE SAME
    8.
    发明公开
    FAN MODULE AND ELECTRONIC DEVICE USING THE SAME 审中-公开
    风扇模块和使用该风扇模块的电子设备

    公开(公告)号：EP3287639A1

    公开(公告)日：2018-02-28

    申请号：EP17175583.8

    申请日：2017-06-12

    申请人： Acer Incorporated

    发明人： WANG, Yung-Chih ,  HSIEH, Cheng-Wen ,  LIN, Kuang-Hua ,  CHENG, Cheng-Yu ,  LIAO, Wen-Neng

    IPC分类号： F04D17/16 ,  F04D29/42 ,  F04D29/44

    CPC分类号： F04D29/666 ,  F04D17/16 ,  F04D25/0613 ,  F04D29/281 ,  F04D29/4226 ,  F04D29/4233 ,  F04D29/441 ,  G06F1/203 ,  H05K7/20145 ,  H05K7/20172

    摘要： A fan module and an electronic device using the fan module are provided. The fan module includes a housing, a fan blade assembly, and a fan hub. The housing has a first surface on which plural wind guiding structures are arranged. The fan blade assembly is pivoted to the housing through the fan hub and adapted to rotate along a rotation direction. The wind guiding structures are arranged along a circumferential direction of the fan hub to guide a wind flow into the housing while the fan blade assembly is being rotated.

    摘要翻译： 提供风扇模块和使用该风扇模块的电子装置。 风扇模块包括壳体，风扇叶片组件和风扇轮毂。 壳体具有其上布置有多个导风结构的第一表面。 风扇叶片组件通过风扇轮毂枢转至壳体并适于沿着旋转方向旋转。 当风扇叶片组件旋转时，导风结构沿着风扇轮毂的圆周方向布置以引导风流进入外壳。

    CENTRIFUGAL HEAT DISSIPATION FAN
    9.
    发明公开
    CENTRIFUGAL HEAT DISSIPATION FAN 审中-公开

    公开(公告)号：EP4269808A1

    公开(公告)日：2023-11-01

    申请号：EP23170407.3

    申请日：2023-04-27

    申请人： Acer Incorporated

    发明人： HSIEH, Cheng-Wen ,  LIAO, Wen-Neng ,  LIN, Kuang-Hua ,  CHEN, Wei-Chin ,  CHEN, Tsung-Ting

    IPC分类号： F04D29/28 ,  F04D29/30 ,  F04D29/66 ,  F04D17/16

    摘要： A centrifugal heat dissipation fan (100) including a hub (130), a frame (140, 140A, 140C), and double-layer fan blade sets (110, 120) is provided. The double-layer fan blade sets (110, 120) surround the hub (130) and are arranged along a radial direction (X2) at an inner layer and an outer layer. A gap (G1) is maintained along the radial direction (X2) between the fan blade set (110) located at the inner layer and the fan blade set (120) located at the outer layer. The frame (140, 140A, 140C) is connected to the hub (130) and the fan blade set (120) located at the outer layer.