An electronic component manufacturing method includes a blotting process of bringing a conductive paste 4 applied to an end portion of each electronic component body 1 held by a jig into contact with a surface 101 of a surface plate 100. The blotting process includes simultaneous performance of a distance changing process of changing the distance between an end face 2A of each electronic component body 1 and the surface 101 of the surface plate 100 and a position changing process of changing a two-dimensional position where the end face 2A of the electronic component body 1 is projected on the surface 101 of the surface plate 100 in such a manner that the direction of the movement of two-dimensional position in parallel to the surface 101 of the surface plate 100 successively varies (e.g., along a circular path).