发明公开

SEMICONDUCTOR DEVICE
摘要:
Provided is an IGBT capable of achieving both low conduction loss and low switching loss in the IGBT and achieving low power consumption, and a power conversion device to which the IGBT is applied. The semiconductor device includes a first conductivity type semiconductor layer formed on a first main surface of a semiconductor substrate, a second conductivity type well region formed on the first main surface side and in contact with the first conductivity type semiconductor layer, a first gate electrode and a second gate electrode adjacent to each other across the second conductivity type well region and in contact with the first conductivity type semiconductor layer and the second conductivity type well region through a gate insulating film, a first conductivity type emitter region formed on the first main surface side of the second conductivity type well region, a second conductivity type power supply region that penetrates the first conductivity type emitter region and is electrically connected to the second conductivity type well region, an emitter electrode electrically connected to the second conductivity type well region through the second conductivity type power supply region, a second conductivity type collector layer formed on a second main surface side of the semiconductor substrate that is opposite to the first main surface side and in contact with the first conductivity type semiconductor layer, and a collector electrode electrically connected to the second conductivity type collector layer. An interval between the first gate electrode and the second gate electrode is narrower than an interval between the first gate electrode and another adjacent gate electrode and an interval between the second gate electrode and another adjacent gate electrode. Each of the first gate electrode and the second gate electrode is electrically connected to any of a switching gate wiring and a carrier control gate wiring. The number of gate electrodes connected to the carrier control gate wiring is larger than the number of gate electrodes connected to the switching gate wiring.
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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/70 ...双极器件
H01L29/72 ....晶体管型器件,如连续响应于所施加的控制信号的
H01L29/739 .....受场效应控制的
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