- 专利标题: GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING UNDERLYING DOPANT-DIFFUSION BLOCKING LAYERS
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申请号: EP19183069.4申请日: 2019-06-27
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公开(公告)号: EP3647262A1公开(公告)日: 2020-05-06
- 发明人: GLASS, Glenn , MURTHY, Anand , GUHA, Biswajeet , CRUM, Dax , KEYS, Patrick , GHANI, Tahir , GHOSE, Susmita , COOK JR, Ted
- 申请人: INTEL Corporation
- 申请人地址: 2200 Mission College Blvd. Santa Clara, CA 95054 US
- 专利权人: INTEL Corporation
- 当前专利权人: INTEL Corporation
- 当前专利权人地址: 2200 Mission College Blvd. Santa Clara, CA 95054 US
- 代理机构: 2SPL Patentanwälte PartG mbB
- 优先权: US201816146785 20180928
- 主分类号: B82Y10/00
- IPC分类号: B82Y10/00 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/66 ; H01L29/775 ; H01L29/423
摘要:
Gate-all-around integrated circuit structures having underlying dopant-diffusion blocking layers (250) are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires (206) above a fin. The fin includes a dopant diffusion blocking layer (250) on a first semiconductor layer (202), and a second semiconductor layer on the dopant diffusion blocking layer. A gate stack (226, 228) is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure (222, 224) is at a first end of the vertical arrangement of horizontal nanowires. A second epitaxial source or drain structure (222, 224) is at a second end of the vertical arrangement of horizontal nanowires.
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