- 专利标题: A METHOD OF PRODUCING AN ARRAY OF MICRO-LEDS
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申请号: EP19177112.0申请日: 2019-05-28
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公开(公告)号: EP3745475A1公开(公告)日: 2020-12-02
- 发明人: Ebbecke, Jens
- 申请人: OSRAM Opto Semiconductors GmbH
- 申请人地址: Leibnizstraße 4 93055 Regensburg DE
- 专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人地址: Leibnizstraße 4 93055 Regensburg DE
- 代理机构: Zacco Patent- & Rechtsanwälte
- 主分类号: H01L33/40
- IPC分类号: H01L33/40 ; H01L27/15
摘要:
A method of producing an array of micro-LEDs (11), the method comprises the step of:
providing an array of micro-LEDs (11)comprising:
a substrate (13), and
a plurality of micro-LEDs (15), wherein the micro-LEDs (15) form an array-like arrangement on a topside (17) of the substrate (13), and
wherein a lower surface (27) of each micro-LED (15) is arranged on the topside (17) of the substrate (13), wherein each micro-LED (15) comprises:
a layered structure with a first doped layer (19), a second doped layer (21), and an active layer (23) between the first doped layer (19) and the second doped layer (21),
wherein the layered structure has sidewalls (25) extending between an upper surface (27) and a lower surface (29) of the layered structure and forming an outer boundary of at least the first doped layer (19), the second doped layer (21), and the active layer (23),
wherein the upper surface (27) extends above the first doped layer (19) and the lower surface (29) extends below the second doped layer (21),
wherein a first insulating layer (31) is arranged on the upper surface (27) and a second insulating layer (33) is arranged on the sidewalls (25),
wherein the first insulating layer (31) has a through opening (35) at the upper surface (27),
the method further comprises the step of:
depositing a conductive layer (37) on each of the micro-LEDs (15) of the array of micro-LEDs (11), such that the conductive layer (37) is disposed over the first insulating layer (31) and protrudes into the opening (35) and contacts the upper surface (27) and such that the conductive layer (37) covers the second insulating layer (33),
wherein the step of depositing the conductive layer (37) comprises:
exposing the array of micro-LEDs to a material beam (41) comprising material for forming the conductive layer (37),
wherein the material beam (15) has a beam direction (D), and wherein the array of micro-LEDs (11) is disposed in the material beam (41) such that the micro-LEDs (15) face the material beam (41),
wherein a surface normal (N) is perpendicular to the topside (17) of the substrate (13), and wherein the surface normal (N) and the beam direction (D) include an angle (α) which is not zero degrees.
providing an array of micro-LEDs (11)comprising:
a substrate (13), and
a plurality of micro-LEDs (15), wherein the micro-LEDs (15) form an array-like arrangement on a topside (17) of the substrate (13), and
wherein a lower surface (27) of each micro-LED (15) is arranged on the topside (17) of the substrate (13), wherein each micro-LED (15) comprises:
a layered structure with a first doped layer (19), a second doped layer (21), and an active layer (23) between the first doped layer (19) and the second doped layer (21),
wherein the layered structure has sidewalls (25) extending between an upper surface (27) and a lower surface (29) of the layered structure and forming an outer boundary of at least the first doped layer (19), the second doped layer (21), and the active layer (23),
wherein the upper surface (27) extends above the first doped layer (19) and the lower surface (29) extends below the second doped layer (21),
wherein a first insulating layer (31) is arranged on the upper surface (27) and a second insulating layer (33) is arranged on the sidewalls (25),
wherein the first insulating layer (31) has a through opening (35) at the upper surface (27),
the method further comprises the step of:
depositing a conductive layer (37) on each of the micro-LEDs (15) of the array of micro-LEDs (11), such that the conductive layer (37) is disposed over the first insulating layer (31) and protrudes into the opening (35) and contacts the upper surface (27) and such that the conductive layer (37) covers the second insulating layer (33),
wherein the step of depositing the conductive layer (37) comprises:
exposing the array of micro-LEDs to a material beam (41) comprising material for forming the conductive layer (37),
wherein the material beam (15) has a beam direction (D), and wherein the array of micro-LEDs (11) is disposed in the material beam (41) such that the micro-LEDs (15) face the material beam (41),
wherein a surface normal (N) is perpendicular to the topside (17) of the substrate (13), and wherein the surface normal (N) and the beam direction (D) include an angle (α) which is not zero degrees.
公开/授权文献
- EP3745475B1 A METHOD OF PRODUCING AN ARRAY OF MICRO-LEDS 公开/授权日:2024-03-06
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