The invention is related to a reconditioning wafer (1) comprising a carrier substrate (2) that supports at least one array of regularly spaced protrusions (3,5,6,7+8) suitable for forming indentations in a support surface of a wafer holding stage. The protrusions within the same array have essentially the same shape and the same dimensions, thereby enabling a more reliable reconditioning process compared to prior art solutions. The protrusions may have the form of pyramids (3) or pillars (6) or other similar shapes with at least the tip of the protrusions formed of a material suitable for making the indentations. The reconditioning wafer is obtainable by a molding technique wherein an array of molds (11) is created in a mold substrate (10), after which the molds are filled with an indentation material such as diamond, and bonded to the carrier substrate (2), after which the mold substrate is removed by thinning and wet etching.