According to one embodiment of the present invention, a method of manufacturing a thermoelectric leg comprises: preparing a first metal substrate including a first metal, forming a first plated layer including a second metal on the first metal substrate, disposing a layer including tellurium (Te) on the first plated layer, forming a portion of the first plated layer as a first bonding layer by reacting the second metal and the Te, disposing a thermoelectric material layer including bismuth (Bi) and Te on an upper surface of the first bonding layer, disposing a second metal substrate, on which a second bonding layer and a second plated layer are formed, on the thermoelectric material layer, and sintering.