- 专利标题： COMPONENT CARRIER HAVING COMPONENT COVERED WITH ULTRA-THIN TRANSITION LAYER
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申请号： EP20217845.5申请日： 2020-12-30
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公开(公告)号： EP3855487A1公开(公告)日： 2021-07-28
- 发明人: Tuominen, Mikael , Tay, Seok Kim , Liu, Kim , Baftiri, Artan , Guo, Henry
- 申请人： At&S (China) Co., Ltd.
- 申请人地址： CN Shanghai 201108 No. 5000 Jindu Road Xinzhuang Industry Park Minhang District
- 代理机构： Dilg, Haeusler, Schindelmann Patentanwaltsgesellschaft mbH
- 优先权： CN202010073861 20200122
- 主分类号： H01L23/538
- IPC分类号： H01L23/538
摘要：
A method of manufacturing a component carrier (100), wherein the method comprises providing a laminated stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), at least partially covering a component (108) with a transition layer (110) having a thickness (D) in a range from 0.5 nm to 1 µm, and assembling the component (108) with the stack (102).
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