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公开(公告)号：EP3855487A1
公开(公告)日：2021-07-28
申请号：EP20217845.5
申请日：2020-12-30
发明人： Tuominen, Mikael , Tay, Seok Kim , Liu, Kim , Baftiri, Artan , Guo, Henry
IPC分类号： H01L23/538
摘要： A method of manufacturing a component carrier (100), wherein the method comprises providing a laminated stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), at least partially covering a component (108) with a transition layer (110) having a thickness (D) in a range from 0.5 nm to 1 µm, and assembling the component (108) with the stack (102).
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2.发明公开
公开(公告)号：EP3657915A3
公开(公告)日：2020-11-18
申请号：EP19209423.3
申请日：2019-11-15
发明人： Mok, Jeesoo , Tay, Seok Kim , Tuominen, Mikael , Wu, Yu-Hui
IPC分类号： H05K1/18 , H01L23/538 , H01L21/48 , H01L23/31 , H01L23/498 , H01L21/683 , H05K3/00
摘要： A method of manufacturing a first component carrier (100a) and a second component carrier (100b), the method comprising: i) providing a separation component (150) comprising a first separation surface (151) and a second separation surface (152) being opposed to the first separation surface (151), ii) coupling a first base structure (110) having a first cavity (111) with the first separation surface (151), iii) coupling a second base structure (120) having a second cavity (121) with the second separation surface (152), iv) placing a first electronic component (115) in the first cavity (111), v) connecting the first base structure (110) with the first electronic component (115) to form the first component carrier (100a), vi) placing a second electronic component (125) in the second cavity (112), vii) connecting the second base structure (120) with the second electronic component (125) to form the second component carrier (100b), viii) separating the first component carrier (100a) from the first separation surface (151) of the separation component (150), and ix) separating the second component carrier (100b) from the second separation surface (152) of the separation component (150).
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3.发明公开
公开(公告)号：EP3369295A1
公开(公告)日：2018-09-05
申请号：EP16859186.5
申请日：2016-10-29
发明人： TUOMINEN, Mikael
IPC分类号： H05K3/46
CPC分类号： H05K3/4694 , C09J9/02 , H05K1/144 , H05K3/323 , H05K3/4697 , H05K2203/061
摘要： A component carrier includes a plurality of low density layer structures, and a plurality of high density layer structures having a higher density of electrically conductive structures than the plurality of low density layer structures,—where the low density layer structures and the high density layer structures are alternatingly vertically stacked.
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4.发明公开
公开(公告)号：EP3351065A1
公开(公告)日：2018-07-25
申请号：EP16845819.8
申请日：2016-09-16
IPC分类号： H05K3/46
CPC分类号： H05K3/4682 , H05K1/0269 , H05K3/0097 , H05K3/022 , H05K3/108 , H05K3/32 , H05K3/4007 , H05K2201/068 , H05K2201/09918 , H05K2201/09936 , H05K2203/0156 , H05K2203/0264
摘要： A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The sacrificial structure includes a central structure and releasing layers on or over both opposing main surfaces of the central structure The central structure includes a dummy core being covered, in particular fully, on or over both main surfaces thereof with a respective one of two spatially separated sections of separate material, in particular separate dielectric material.
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5.发明公开COMPONENT CARRIER COMPRISING A COPPER FILLED MULTIPLE-DIAMETER LASER DRILLED BORE 审中-公开包含铜填充多个直径激光钻孔的元件载体
公开(公告)号：EP3200570A1
公开(公告)日：2017-08-02
申请号：EP17153635.2
申请日：2017-01-27
CPC分类号： H05K1/0206 , H05K1/0209 , H05K1/09 , H05K1/112 , H05K1/181 , H05K3/0026 , H05K3/0035 , H05K3/42 , H05K2201/09509 , H05K2201/096 , H05K2201/09781 , H05K2201/09827 , H05K2201/09854 , H05K2203/107 , H05K2203/1476
摘要： The present invention relates to a component carrier (100) comprising a layer stack (101) formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore (110) extends into the layer stack (101) and has a first bore section (111) with a first diameter (D1) and a connected second bore section (112) with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material (102) fills substantially the entire bore (110). The bore is in particular formed by laser drilling.
摘要翻译： 本发明涉及包括由电绝缘结构和导电结构形成的叠层（101）的部件载体（100）。 此外，孔（110）延伸到层叠体（101）中并具有具有第一直径（D1）的第一孔部分（111）和具有不同于第二直径（D2）的第二直径（D2）的连接的第二孔部分 第一直径（D1）。 导热材料（102）基本填充整个孔（110）。 孔特别是通过激光钻孔形成。
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公开(公告)号：EP4053657A1
公开(公告)日：2022-09-07
申请号：EP22160240.2
申请日：2022-03-04
发明人： ZHOU, Yuan Fang , LI, Hao , BRENNER, Thomas
IPC分类号： G05B19/418 , G06Q10/06 , G06Q50/04
摘要： A method for allocating resources (104) to machines (102) of a production facility (100) comprises: receiving forecast data (204) indicating planned demands (214) for the resources (104) and a demand deviation (216) for each resource (104); generating a new demand (220) for each resource (104) from the planned demand (214) and the demand deviation (216) of the resource (104) in several iterations; assigning capacities to the new demands (220) in each iteration by determining resource-machine combinations (106), wherein a priority is determined for each resource (104) and each machine (102) based on a set of priority rules (226; 226a, 226b, 226c, 226d, 226e), wherein the resource-machine combinations (106) are determined by combining the resources (104) and the machines (102) according to the priorities; and generating a roll-out plan (228) assigning resource-machine combinations (106) to be rolled out to future time periods, wherein the roll-out plan (228) is generated from the resource-machine combinations (106) of different iterations and an estimated roll-out time for each resource-machine combination (106) such that a total number of the resource-machine combinations (106) to be rolled-out is minimized.
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公开(公告)号：EP4053656A2
公开(公告)日：2022-09-07
申请号：EP22160239.4
申请日：2022-03-04
发明人： REID, Wallace , GUO, Hailong , ZHANG, Jianfeng , CHEN, Huogen , SUN, Yuanming
IPC分类号： G05B19/418 , G06Q10/06
摘要： A resource allocation system (16) for a production facility (10) stores: a production schedule (32) assigning production tasks (34) to machines (12) of the production facility (10), each production task (34) comprising a production time window during which a machine (12) is occupied with the production task (34); a maintenance schedule (36) assigning maintenance tasks (38) to service resources (22), each maintenance task (38) comprising a maintenance time window during which a machine (12) is occupied with the maintenance task (38); and a maintenance plan (48) comprising maintenance rules (50) for generating maintenance tasks (38), the maintenance rules (50) at least comprising a scheduling rule (50a) from which a time after which a machine (12) has to be maintained is derivable. The resource allocation system (16) is configured for determining maintenance tasks (38) for machines (12) based on the maintenance rules (50), wherein the time window of a maintenance task (38) for a machine (12) is determined from a previous maintenance task (38), the scheduling rule (50a) for the machine (12) and the production tasks (34) for the machine (12), such that the time window of the maintenance task (38) does not overlap with the production tasks (34).
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8.发明公开
公开(公告)号：EP3351066A1
公开(公告)日：2018-07-25
申请号：EP16845820.6
申请日：2016-09-16
CPC分类号： H05K3/4682 , H05K1/0271 , H05K1/0393 , H05K3/0097 , H05K2203/0156 , H05K2203/1536
摘要： A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The component carriers include at least one electrically insulating layer structure, and at least one electrically conductive layer structure. The at least one electrically insulating layer structure relates to a respective one of the component carriers. Located closest to the sacrificial structure are pure or unprocessed electrically insulating layers without electrically conductive material therein.
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公开(公告)号：EP3349552A1
公开(公告)日：2018-07-18
申请号：EP18151449.8
申请日：2018-01-12
发明人： Tuominen, Mikael , Tay, Annie , Abderrazzaq, Ifis
IPC分类号： H05K1/18 , H01L23/538 , H05K3/46
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2924/3511 , H05K3/4602 , H05K2203/0152 , H05K2203/0156 , H05K2203/016
摘要： A semifinished product (100) for manufacturing a component carrier (102), wherein the semifinished product (100) comprises a base structure (104) having a recess (106), a rigid temporary carrier (108) on which the base structure (104) is mounted, and a component (110) mounted in the recess (106).
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公开(公告)号：EP4300576A3
公开(公告)日：2024-06-26
申请号：EP23209817.8
申请日：2017-12-22
CPC分类号： H05K1/0204 , H05K1/185 , H05K3/4652 , H05K2201/1041620130101 , H05K2201/207220130101 , H05K2201/20920130101 , H05K2203/06320130101 , C09J7/00 , H05K2201/02620130101 , H05K2201/032320130101 , H05K2203/019120130101 , C09J2203/32620130101 , H05K2201/0912720130101 , H01L2224/1820130101 , H01L23/49822 , H01L23/13 , H01L23/49816 , H01L23/3677 , H01L23/49827 , H01L23/49894 , C09J2301/3120200801
摘要： A component carrier (106), comprising a stack (116) comprising at least one electrically conductive layer structure (114) and/or at least one electrically insulating layer structure (112), a sheet (100) with nano- and/or microstructures (102) and arranged on and/or in the stack (116), said sheet (100) comprising or consisting of copper.
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