[Problem]
An object of the present invention is to provide a curable organopolysiloxane composition for forming a film, which has low viscosity before curing, has excellent mechanical strength and dielectric breakdown strength after curing, and can provide a uniform and thin organopolysiloxane cured film.
[Resolution Means]
A curable organopolysiloxane composition for forming a film, containing a curing reactive organopolysiloxane, a curing agent, (D1) reinforcing fine particles having a BET specific surface area exceeding 100 m 2 /g, which have been surface treated with an organic silicon compound, and (D2) reinforcing fine particles having a BET specific surface area within a range of 10 to 100 m 2 /g, which have been surface treated with an organic silicon compound, where the mass ratio thereof is with a range of 50:50 to 99:1, and the sum of the components is within a range of 10 to 40 mass%; and a method of manufacturing an organopolysiloxane cured film using the same.