- 专利标题： HIGH IMPACT TOUGHNESS SOLDER ALLOY
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申请号： EP21181116.1申请日： 2012-08-02
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公开(公告)号： EP3907037A1公开(公告)日： 2021-11-10
- 发明人: PANDHER, Ranjit , SINGH, Bawa , SARKAR, Siuli , CHEGUDI, Sujatha , KUMAR, Anil K. N. , CHATTOPADHYAY, Kamanio , LODGE, Dominic , DE AVILA RIBAS, Morgana
- 申请人： Alpha Assembly Solutions Inc.
- 申请人地址： US Waterbury CT 06702 245 Freight Street
- 代理机构： Boult Wade Tennant LLP
- 优先权： US201161514303 P 20110802
- 主分类号： B23K35/26
- IPC分类号： B23K35/26 ; C22C12/00 ; C22C13/02 ; B23K35/02
摘要：
A lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0.003 to 0.5 %wt Co; from greater than 0 to 1.0 %wt Cu; from 0 to 1.0 %wt Ag; one or more of: from 0.001 to 1.0 %wt Sb; from 0.001 to 0.1 %wt Ge; and the balance Sn, together with any unavoidable impurities being not more than 1.0 %wt.
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