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公开(公告)号：EP3766631A3
公开(公告)日：2021-03-24
申请号：EP20181499.3
申请日：2012-08-02
发明人： DE AVILA RIBAS, Morgana , LODGE, Dominic , PANDHER, Ranjit , SINGH, Bawa , BHATKAL, Ravindra M , RAUT, Rahul , SARKAR, Siuli , CHATTOPADHYAY, Kamanio , NANDI, Proloy
摘要： A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
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公开(公告)号：EP3775318A1
公开(公告)日：2021-02-17
申请号：EP19785949.9
申请日：2019-04-08
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公开(公告)号：EP2773484B1
公开(公告)日：2017-05-24
申请号：EP13777315.6
申请日：2013-10-09
发明人： CHOUDHURY, Pritha , DE AVILA RIBAS, Morgana , MUKHERJEE, Sutapa , KUMAR, Anil , SARKAR, Siuli , PANDHER, Ranjit , BHATKAL, Ravi , SINGH, Bawa
CPC分类号： B23K35/262 , B23K1/00 , B23K1/0016 , B23K1/002 , B23K1/0056 , B23K1/012 , B23K1/085 , B23K1/19 , B23K1/203 , B23K35/0222 , B23K35/0227 , B23K35/0233 , B23K35/0244 , B23K35/025 , B23K2203/12 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3463 , Y10T403/479
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公开(公告)号：EP2739431B1
公开(公告)日：2020-06-24
申请号：EP12756541.4
申请日：2012-08-02
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公开(公告)号：EP3659971A1
公开(公告)日：2020-06-03
申请号：EP19211765.3
申请日：2013-10-29
发明人： PANDHER, Ranjit , KHASELEV, Oscar , BHATKAL, Ravi , RAUT, Rahul , SINGH, Bawa , RIBAS, Morgana , GHOSAL, Shamik , SARKAR, Siuli , MUKHERJEE, Sutapa , KUMAR, Sathish , CHANDRAN, Remya , VISHWANATH, Pavan , PACHAMUTHU, Ashok , BOUREGHDA, Monnir , DESAI, Nitin , LIFTON, Anna , CHAKI, Nirmalya Kumar
IPC分类号： C01G5/00 , B22F1/00 , B22F7/08 , B22F9/24 , C09C1/62 , C09C3/08 , C22C1/04 , B82Y30/00 , C09K5/14
摘要： A sintering powder comprising:
a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.-
公开(公告)号：EP4225842A2
公开(公告)日：2023-08-16
申请号：EP21810531.0
申请日：2021-10-07
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公开(公告)号：EP4034321A1
公开(公告)日：2022-08-03
申请号：EP20788707.6
申请日：2020-09-24
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公开(公告)号：EP3915718A1
公开(公告)日：2021-12-01
申请号：EP21187465.6
申请日：2012-08-02
发明人： PANDHER, Ranjit , SINGH, Bawa , SARKAR, Siuli , CHEGUDI, Sujatha , KUMAR, Anil K. N , CHATTOPADHYAY, Kamanio , LODGE, Dominic , DE AVILA RIBAS, Morgana
摘要： A lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0.01 to 0.5 %wt Ni; one or both of: from 0.05 to 1.0 %wt Cu, and from 0.01 to 1.0 wt% Ag; from 0 to 1.0 %wt Sb; and the balance Sn, together with any unavoidable impurities being not more than 1.0 wt.%.
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公开(公告)号：EP3907037A1
公开(公告)日：2021-11-10
申请号：EP21181116.1
申请日：2012-08-02
发明人： PANDHER, Ranjit , SINGH, Bawa , SARKAR, Siuli , CHEGUDI, Sujatha , KUMAR, Anil K. N. , CHATTOPADHYAY, Kamanio , LODGE, Dominic , DE AVILA RIBAS, Morgana
摘要： A lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0.003 to 0.5 %wt Co; from greater than 0 to 1.0 %wt Cu; from 0 to 1.0 %wt Ag; one or more of: from 0.001 to 1.0 %wt Sb; from 0.001 to 0.1 %wt Ge; and the balance Sn, together with any unavoidable impurities being not more than 1.0 %wt.
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公开(公告)号：EP3038790B1
公开(公告)日：2018-02-21
申请号：EP14759052.5
申请日：2014-08-29
发明人： PANDHER, Ranjit , SINGH, Bawa , RAUT, Rahul , SANYOGITA, Arora , BHATKAL, Ravindra , MO, Bin
IPC分类号： B23K1/012 , B23K1/08 , B23K1/19 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/02 , C22C13/00
CPC分类号： B23K35/3612 , B23K1/012 , B23K1/085 , B23K1/19 , B23K35/025 , B23K35/262 , B23K35/3613 , B23K35/362 , C22C13/00
摘要： A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.
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